A positioning jig assembly includes a positioning main body with holes into which electronic component bodies are respectively press-fit, a first and a second guide bodies disposed to be superimposed on the positioning main body in a planar view. First through-holes are formed in the first guide body. Second through-holes formed in the second guide body guide the electronic component main bodies to the first through-holes. The first through-holes provisionally position the electronic component main bodies. When height in the first direction of the electronic component main bodies is represented as H, lengths of the first through-hole and the second through-hole are respectively represented as L1 and L2, and depth of the hole is represented as D, L1<H<D+L1+L2 and D<H hold.

An electronic device includes a fork structure having a pair of arms disposed in spaced relation and defining an open-ended channel therebetween. A surface of channel defines a seat opposite the open end. The channel has a width W.sub.1 at its narrowest section. A rigid wire of an electrical component is disposed in the channel generally adjacent to the seat. The wire has a width W.sub.2 that is greater than the width W.sub.1 so surfaces of the channel at the narrowest section defined by width W.sub.1 interfere with the wire, preventing the wire from moving towards the open end of the channel. The pair of arms are constructed and arranged to be moved toward each other so as to crimp the wire to the fork structure.

An electronic component manufacturing method comprising: a first step of moving an electronic component body in a first direction relative to a dip layer of a conductive paste to immerse the electronic component body in the dip layer; a second step of moving the electronic component body relative to the dip layer in a second direction that is opposite to the first direction, thereby separating the electronic component body from the dip layer; a third step of forcibly cutting a connection between the conductive paste coated on the end portions of the electronic component body and the dip layer, using a contact with a solid or fluid cutter; and a fourth step of removing excess paste from the conductive paste coated on the end portions of the electronic component body. The third and fourth steps may be conducted simultaneously by cutting and removing the paste with the paste removal member.

A method is provided for fabricating a terminal electrode. The terminal electrode is applied on a multilayer ceramic capacitor (MLCC). The method prints inner electrodes on full area together with protective layers. The MLCC uses the thickness of thinned dielectric ceramic layers and the stacking of nickel inner-electrode layers. High capacitance is achieved at ends and sides with high electrode-to-ceramic ratios. Thus, the present invention uses a coating technology of ultra-low-temperature electrochemical deposition to fabricate low internal-stress MLCC terminal electrodes together with insulating protective layers for improving MLCC yield while cost reduced.

A method of manufacturing an electronic component that includes preparing unfired multilayer bodies each including main surfaces opposite to each other in a stacking direction, side surfaces opposite to each other in a width direction, and end surfaces opposite to each other in a length direction. One of the side surfaces of each of the unfired multilayer bodies is bonded to an adhesive sheet, and the other side surface of each of the unfired multilayer bodies is polished by rotating a polishing surface of a rotary polishing machine while contacting the other side surface. An insulating layer is formed on the polished other side surface. In the polishing of the other side surface, at least one of the rotary polishing machine and the adhesive sheet is moved relative to the other thereof to form a polish groove in the length direction.

A power storage device and an applicator is obtained that achieve an increase in capacity and an improvement in productivity, and that enable the thickness of a mixture layer to be inhibited from varying. A positive electrode mixture slurry is discharged into discharge regions of a belt-like positive electrode current collector that extend in a length direction of the positive electrode current collector from discharge nozzles corresponding to the respective discharge regions to form a positive electrode mixture layer on the positive electrode current collector. The discharge regions are arranged such that a part of each of the discharge regions overlaps a part of another of the discharge regions adjacent thereto when viewed in the length direction to form overlapping portions. The positive electrode mixture slurry is intermittently discharged to form an exposed portion on at least one of the discharge regions.

Systems and methods of additively manufacturing passive electronic components are provided. An additive manufacturing device may deposit a material to create a passive electronic component. A sensor may continuously measure an electrical property of the passive electronic component across two electrical contacts as the material is deposited during manufacturing. The sensor may transmit the measured electrical property to a processor whereby the processor may adjust a material deposition rate of the additive manufacturing device. The continuous measurement of the electrical property and adjustment of the material deposition rate as the passive electronic component is produced allows for passive electronic components to be manufactured to a high degree of accuracy of the electrical property.

A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.

A method for manufacturing a multilayer ceramic electronic device includes punching out a ceramic sheet by one of left and right side surfaces of a laminated body so as to form a side margin part on the one of the left and right side surfaces of said laminated body; and punching out another ceramic sheet by another of the left and right side surfaces of the laminated body so as to form a side margin part on the another of the left and right side surfaces of said laminated body, thereby forming a ceramic main body having the laminated body and the pair of side margin parts that respectively cover the left and right side surfaces of the laminated body. The width W is greater than the length L in the multilayer ceramic electronic device.

A method of manufacturing an electronic component includes preparing an unfired multilayer body, bonding one of first and second side surfaces of each unfired multilayer body to an adhesive sheet such that the unfired multilayer bodies are in at least one row, polishing the other side surface of each unfired multilayer body by rotating a polishing surface of a rotary polishing machine in contact with the other side surface of each unfired multilayer body, and forming a first insulating layer on the polished other side surface, wherein in the polishing the other side surface, at least one of the rotary polishing machine and the adhesive sheet is moved relative to the other to form a polish groove in the length direction, and the rotary polishing machine has a cylindrical shape and includes an outer circumferential surface that defines the polishing surface.