An apparatus and a method for processing a capacitor according to the present disclosure may include a clamping module grabbing or releasing a capacitor to transport the capacitor, and a first processing module and a second processing module matched with each other to process and test leads of the capacitor, and simultaneously perform various processes through different processing units formed in the first processing module and symmetrical processing units formed in the second processing module and corresponding to be matched with the processing units. By providing the apparatus and method for processing the capacitor, it is possible to process a larger amount of capacitors assembled to a capacitor assembly and identify and remove the electrical defect before assembled to the assembly.

An apparatus and a method for processing a capacitor according to the present disclosure may include a clamping module grabbing or releasing a capacitor to transport the capacitor, and a first processing module and a second processing module matched with each other to process and test leads of the capacitor, and simultaneously perform various processes through different processing units formed in the first processing module and symmetrical processing units formed in the second processing module and corresponding to be matched with the processing units. By providing the apparatus and method for processing the capacitor, it is possible to process a larger amount of capacitors assembled to a capacitor assembly and identify and remove the electrical defect before assembled to the assembly.

A multilayer electronic component includes: a body including internal electrodes alternately disposed with dielectric layers in a first direction, wherein when a region in which the internal electrodes overlap each other in the first direction is a capacitance forming portion, the internal electrodes include internal electrodes that are curved at end portions thereof in the capacitance forming portion and internal electrodes that are flat in the capacitance forming portion, and in a cross-section of the body in the first and second directions, (F1+F2)/D1×100 is 35 or less, where F1 is a maximum distance from an uppermost internal electrode to an uppermost flat internal electrode in the first direction, F2 is a maximum distance from a lowermost internal electrode to a lowermost flat internal electrode in the first direction, and D1 is a size of the capacitance forming portion in the first direction at the center thereof in the second direction.

A multilayer electronic component includes: a body including internal electrodes alternately disposed with dielectric layers in a first direction, wherein when a region in which the internal electrodes overlap each other in the first direction is a capacitance forming portion, the internal electrodes include internal electrodes that are curved at end portions thereof in the capacitance forming portion and internal electrodes that are flat in the capacitance forming portion, and in a cross-section of the body in the first and second directions, (F1+F2)/D1×100 is 35 or less, where F1 is a maximum distance from an uppermost internal electrode to an uppermost flat internal electrode in the first direction, F2 is a maximum distance from a lowermost internal electrode to a lowermost flat internal electrode in the first direction, and D1 is a size of the capacitance forming portion in the first direction at the center thereof in the second direction.

Disclosed herein are dendritically porous three-dimensional structures, including hierarchical dendritically porous three-dimensional structures. The structures include metal foams and graphite structures, and are useful in energy storage devices as well as chemical catalysis.

A multilayer ceramic electronic component includes a multilayer body including two major surfaces opposite to each other in a layer stacking direction, two side surfaces opposite to each other in a widthwise direction orthogonal or substantially orthogonal to the layer stacking direction, and two end surfaces opposite to each other in a lengthwise direction orthogonal or substantially orthogonal to the layer stacking direction and the widthwise direction, and external electrodes provided on the two end surfaces. A method for manufacturing the multilayer ceramic capacitor component includes preparing a plurality of multilayer bodies, stacking the plurality of multilayer bodies via a binder, rotating the plurality of multilayer bodies by about 90° with the lengthwise direction defining and functioning as an axis of rotation, and providing a side gap portion; and removing the binder from the multilayer body provided with the side gap portion.

A method for manufacturing a high-profile capacitor with high capacity includes providing a substrate, forming a first mold layer, a first supporter layer, a second mold layer, and a second supporter layer on the substrate, where at least one of the first mold layer and the second mold layer are made of a dielectric material having a low or super low dielectric constant, defining at least one contact hole, where the now-surrounding first and second supporter layers reinforce the at least one contact hole and form first and second supporter patterns respectively, forming a lower electrode on an inner surface of the at least one contact hole, and removing the first mold layer and/or the second mold layer being made of the dielectric material by ashing.

A method for manufacturing a high-profile capacitor with high capacity includes providing a substrate, forming a first mold layer, a first supporter layer, a second mold layer, and a second supporter layer on the substrate, where at least one of the first mold layer and the second mold layer are made of a dielectric material having a low or super low dielectric constant, defining at least one contact hole, where the now-surrounding first and second supporter layers reinforce the at least one contact hole and form first and second supporter patterns respectively, forming a lower electrode on an inner surface of the at least one contact hole, and removing the first mold layer and/or the second mold layer being made of the dielectric material by ashing.

An method of forming a metal foil coated ceramic and a metal foil capacitor is provided in a method of making a metal foil coated ceramic comprising providing a metal foil; applying a ceramic precursor to the metal foil wherein the ceramic precursor comprises at least one susceptor and a high dielectric constant oxide and an organic binder, and sintering the ceramic precursor with a high intensity, high pulse frequency light energy to form the metal foil ceramic.

An method of forming a metal foil coated ceramic and a metal foil capacitor is provided in a method of making a metal foil coated ceramic comprising providing a metal foil; applying a ceramic precursor to the metal foil wherein the ceramic precursor comprises at least one susceptor and a high dielectric constant oxide and an organic binder, and sintering the ceramic precursor with a high intensity, high pulse frequency light energy to form the metal foil ceramic.