A wiring module to be attached to a plurality of power storage devices arranged in an arrangement direction, the wiring module including: an insulating protector; and a flexible printed wiring board disposed in the protector, wherein the protector has a shape extending in the arrangement direction, the flexible printed wiring board includes a main body part extending in the arrangement direction and disposed in the protector, and an extension piece extending from the main body part, the extension piece has a curved portion that is curved, and the extension piece is inverted by the curved portion, and the protector includes a locking part that locks to the extension piece from a direction to prevent the curved portion from deforming back to an original shape thereof.

A dielectric film for a film capacitor includes (A) a thermoplastic resin and (B) a metal diketone complex.

A dielectric film for a film capacitor includes (A) a thermoplastic resin and (B) a metal diketone complex.

A carrier includes first and second container portions that are assembled together to provide a structure the supports and retains a capacitor. The first container portion and the second container portion are assembled together in a configuration in which the edges of the first wall structures face corresponding ones of the edges of the second wall structures, and the edges of the first wall structures are overlapping with respect to the corresponding ones of the edges of the second wall structures when the carrier is viewed in side view.

A carrier includes first and second container portions that are assembled together to provide a structure the supports and retains a capacitor. The first container portion and the second container portion are assembled together in a configuration in which the edges of the first wall structures face corresponding ones of the edges of the second wall structures, and the edges of the first wall structures are overlapping with respect to the corresponding ones of the edges of the second wall structures when the carrier is viewed in side view.

Provided in a power storage module including: a plurality of power storage devices; and a first current collector that holds the plurality of power storage devices. The plurality of power storage devices each include a case having an opening, an electrode assembly including a first electrode and a second electrode housed in the case, and a sealing member that seals the opening. The case includes a tubular part including one end provided with the opening, and a bottom that closes the other end of the tubular part. The case is electrically connected to the first electrode. The first current collector has a plurality of first through-holes that set and position the corresponding one of the plurality of electric storage devices, and the plurality of first through-holes each have a periphery electrically connected to the case. This structure enables improving energy density of the power storage module.

A capacitor module is provided with a case with a bottom surface and an opening, a first capacitor group including first capacitors each having first and second electrodes, and a side surface connecting the first and second electrodes, a second capacitor group including second capacitors each having third and fourth electrodes, and a side surface connecting the third and fourth electrodes, a first bus bar having an electrode contact portion in contact with the first electrode, a second bus bar having an electrode contact portion in contact with the third electrode, a third bus bar having an electrode contact portion commonly in contact with the second electrode and the fourth electrode, a sealing resin filled in the case; and an insulating member provided between the electrode contact portion of the first bus bar and the electrode contact portion of the second bus bar and surrounded by the sealing resin.

A capacitor and a method for manufacturing the capacitor are provided. The capacitor comprises (1) a capacitor main body including an outer package case, an opening sealing member attached to an inside of an open portion of the outer package case and a terminal lead penetrating through the opening sealing member; (2) a base attached to an outside of the open portion of the outer package case, the base including an insertion through hole through which the terminal lead passes to be disposed on an outer side of the base; and (3) a resin layer between the base and the opening sealing member.

A capacitor and a method for manufacturing the capacitor are provided. The capacitor comprises (1) a capacitor main body including an outer package case, an opening sealing member attached to an inside of an open portion of the outer package case and a terminal lead penetrating through the opening sealing member; (2) a base attached to an outside of the open portion of the outer package case, the base including an insertion through hole through which the terminal lead passes to be disposed on an outer side of the base; and (3) a resin layer between the base and the opening sealing member.

A multilayer ceramic capacitor includes a stacked body and external electrodes. The stacked body includes stacked dielectric layers and internal electrodes. The external electrodes are disposed on lateral surfaces of the stacked body and are connected to the internal electrodes. The dielectric layers include outer layer portions and an effective layer portion. Each outer layer portion is adjacent to a corresponding main surface of the stacked body. Each outer layer portion is a dielectric layer located between a corresponding main surface and an internal electrode closest to the main surface. A ratio of a dimension of the effective layer portion in a stacking direction to a dimension of the stacked body in the stacking direction is not less than about 53% and not more than about 83%.