Patent classifications
H01G2/10
Capacitor carrier assembly with housing having expansion features
A carrier includes first and second container portions that are assembled together to provide a structure the supports and retains a capacitor. The first container portion and the second container portion are assembled together in a configuration in which the edges of the first wall structures face corresponding ones of the edges of the second wall structures, and the edges of the first wall structures are overlapping with respect to the corresponding ones of the edges of the second wall structures when the carrier is viewed in side view.
CAPACITOR MODULE AND A METHOD OF MAKING THEREOF
A capacitor module is provided with a case with a bottom surface and an opening, a first capacitor group including first capacitors each having first and second electrodes, and a side surface connecting the first and second electrodes, a second capacitor group including second capacitors each having third and fourth electrodes, and a side surface connecting the third and fourth electrodes, a first bus bar having an electrode contact portion in contact with the first electrode, a second bus bar having an electrode contact portion in contact with the third electrode, a third bus bar having an electrode contact portion commonly in contact with the second electrode and the fourth electrode, a sealing resin filled in the case; and an insulating member provided between the electrode contact portion of the first bus bar and the electrode contact portion of the second bus bar and surrounded by the sealing resin.
CAPACITORS ENCAPSULATED WITH AT LEAST ONE POLYMER HAVING HIGH THERMAL STABILITY
Some embodiments of the present disclosure relate to a device comprising: a capacitor and at least one encapsulant. In some embodiments, the at least one encapsulant comprises at least one polymer. In some embodiments, the at least one encapsulant at least partially encapsulates the capacitor. In some embodiments, the at least one encapsulant has a stable Young's modulus. Some embodiments of the present disclosure further relate to methods of manufacturing and using the device described herein. In the examples the at least one polymer is a PVDF.
ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD
An electronic component includes: a conductive pattern provided on the main surface of a substrate and constituting a lower electrode; a dielectric film that covers top and side surfaces of the conductive pattern; and a conductive pattern stacked on the top surface of the conductive pattern through the dielectric film and constituting an upper electrode. A part of the dielectric film that is parallel to the main surface of the substrate is removed at least partly. Partially removing a part of the dielectric film that is parallel to the main surface of the substrate allows stress relaxation. This prevents peeling at the interface between the lower electrode and the dielectric film.
MULTILAYER ELECTRONIC COMPONENT
A multilayer electronic component according to another exemplary embodiment of the present disclosure may prevent penetration of moisture by disposing the sealing portions between an external electrode and a body, wherein the sealing portions includes a first sealing portion and a second sealing portion, and an average length of the second sealing portion is 20 μm or more.
POWER STORAGE MODULE
A power storage module including: a plurality of power storage devices; and a holder that holds the plurality of power storage devices, wherein each of the power storage devices includes a case including an opening, an electrode assembly accommodated in the case and including a first electrode and a second electrode, and a sealing member that seals the opening, the case includes a cylindrical cylinder part, an opening end part corresponding to the opening provided at one end part of the cylinder part, and a bottom part that closes another end part of the cylinder part, in each of the plurality of power storage devices, at least a part of an outer peripheral surface of the cylinder part is covered with an insulating layer, and positions of a pair of the power storage devices adjacent to each other included in the plurality of power storage devices are regulated by the insulating layer.
POWER STORAGE MODULE
A power storage module including: a plurality of power storage devices; and a holder that holds the plurality of power storage devices, wherein each of the power storage devices includes a case including an opening, an electrode assembly accommodated in the case and including a first electrode and a second electrode, and a sealing member that seals the opening, the case includes a cylindrical cylinder part, an opening end part corresponding to the opening provided at one end part of the cylinder part, and a bottom part that closes another end part of the cylinder part, in each of the plurality of power storage devices, at least a part of an outer peripheral surface of the cylinder part is covered with an insulating layer, and positions of a pair of the power storage devices adjacent to each other included in the plurality of power storage devices are regulated by the insulating layer.
ELECTRONIC COMPONENT, ELECTRONIC COMPONENT MANUFACTURING METHOD, CAPACITOR, AND CAPACITOR MANUFACTURING METHOD
An electronic component includes an electronic component element and a barrier film. The electronic component element has external electrodes at both ends thereof. The barrier film covers at least a part of a periphery of the electronic component element. The barrier film includes an insulating film having electrical insulating property and a clay layer containing clay.
METHOD FOR MANUFACTURING ELECTRICAL PRODUCT, AND ELECTRICAL PRODUCT
An electrical product including: an electrical component; a first power supply member and a second power supply member; and an insulating plate provided between the first power supply member and the second power supply member. The first power supply member is formed with a fixing hole which penetrates the first power supply member. The insulating plate is formed with a protrusion inserted into the fixing hole. The product is manufactured by preparing a jig with a recessed hole; placing the first power supply member on the jig; placing the insulating plate on the first power supply member so that the protrusion penetrates the fixing hole and the recessed hole.
CAPACITOR AND METHOD FOR MANUFACTURING SAME
A second busbar is provided that has a second electrode terminal and a second connection terminal. A first busbar is provided that has a first electrode terminal, a lateral side coupler, an overhang, and a first connection terminal. The first electrode terminal and/or the second electrode terminal has a protruding piece for connection (connecting protrusion). This protruding piece is elastically depressible in response to contact with an electrode surface of a capacitor element unit inserted from an opposite side of the lateral side coupler across a space between the first and second electrode terminals.