H01G2/12

Motor controller assembly with containment system for capacitor

A motor controller assembly is configured for use with an electric motor and includes a controller and an absorbent pad. The controller includes a capacitor with a capacitor shell and a liquid electrolyte contained therein. The capacitor shell has a frangible rupture area that opens during a capacitor rupture event to permit the discharge of liquid electrolyte from the capacitor shell. The absorbent pad overlies the rupture area to collect discharged liquid electrolyte.

ECA oxide-resistant connection to a hermetic seal ferrule for an active implantable medical device

A hermetically sealed feedthrough assembly for an active implantable medical device having an oxide-resistant electrical attachment for connection to an EMI filter, an EMI filter circuit board, an AIMD circuit board, or AIMD electronics. The oxide-resistant electrical attachment, including an oxide-resistant sputter layer 165 is disposed on the device side surface of the hermetic seal ferrule over which an ECA stripe is provided. The ECA stripe may comprise one of a thermal-setting electrically conductive adhesive, an electrically conductive polymer, an electrically conductive epoxy, an electrically conductive silicone, an electrically conductive polyimides, or an electrically conductive polyimide, such as those manufactured by Ablestick Corporation. The oxide-free electrical attachment between the ECA stripe and the filter or AIMD circuits may comprise one of gold, platinum, palladium, silver, iridium, rhenium, rhodium, tantalum, tungsten, niobium, zirconium, vanadium, and combinations or alloys thereof.

ECA oxide-resistant connection to a hermetic seal ferrule for an active implantable medical device

A hermetically sealed feedthrough assembly for an active implantable medical device having an oxide-resistant electrical attachment for connection to an EMI filter, an EMI filter circuit board, an AIMD circuit board, or AIMD electronics. The oxide-resistant electrical attachment, including an oxide-resistant sputter layer 165 is disposed on the device side surface of the hermetic seal ferrule over which an ECA stripe is provided. The ECA stripe may comprise one of a thermal-setting electrically conductive adhesive, an electrically conductive polymer, an electrically conductive epoxy, an electrically conductive silicone, an electrically conductive polyimides, or an electrically conductive polyimide, such as those manufactured by Ablestick Corporation. The oxide-free electrical attachment between the ECA stripe and the filter or AIMD circuits may comprise one of gold, platinum, palladium, silver, iridium, rhenium, rhodium, tantalum, tungsten, niobium, zirconium, vanadium, and combinations or alloys thereof.

ELECTRICAL UNIT
20170367199 · 2017-12-21 · ·

An electrical unit (1) having a housing (5) having a first wall (7) and a circuit board (3) mounted inside the housing (5), wherein an inner side (7a) of the first wall (7) is provided with a mounting arrangement (17) for holding an electrical component (45).

An outer side (7b) of the first wall (7) is provided with a disassembling marking (53, 55, 57) which corresponds to an outer boundary (65, 67, 69) of a mounting arrangement foundation designating a portion of the first wall which may be cut or removed upon disassembly of the electrical unit (39, 41, 43).

Multilayer ceramic capacitor
09831036 · 2017-11-28 · ·

A ceramic body includes outer layer portions of about 15 μm or more and about 25 μm or less in thickness outside an inner layer portion where internal electrodes are stacked with dielectric ceramic layers interposed therebetween, the inner layer portion includes inner cover electrodes opposed to the internal electrode located outermost in the stacking direction with the dielectric ceramic layers interposed therebetween, the outer layer portions include outer cover electrodes opposed to the inner cover electrodes with the dielectric ceramic layers interposed therebetween, the inner cover electrodes have a coverage of about 75% or more and about 100% or less, the outer cover electrodes have a coverage of about 50% or more and about 70% or less, and boundary layers containing Mg and Mn are provided at the boundaries between the outer cover electrodes and the dielectric ceramic layers located outside the electrodes.

STACKED-TYPE SOLID ELECTROLYTIC CAPACITOR CAPABLE OF INCREASING WELDING EFFECT AND MANUFACTURING METHOD OF THE SAME
20170338049 · 2017-11-23 ·

The instant disclosure relates to a stacked-type solid electrolytic capacitor capable of increasing welding effect and a manufacturing method of the same. The stacked-type solid electrolytic capacitor includes a plurality of solid electrolytic capacitor units, each of which has an anode part and a cathode part connected to the anode part, characterized in that the anode part is formed with at least one buffering via-hole in a welding area thereof. When each of the anode parts is compressed in a welding process, the volume of the corresponding buffering via-hole decreases accordingly. Therefore, the soldering performance of the anode part solid electrolytic capacitor is enhanced and the connection stability is increased.

STACKED-TYPE SOLID ELECTROLYTIC CAPACITOR CAPABLE OF INCREASING WELDING EFFECT AND MANUFACTURING METHOD OF THE SAME
20170338049 · 2017-11-23 ·

The instant disclosure relates to a stacked-type solid electrolytic capacitor capable of increasing welding effect and a manufacturing method of the same. The stacked-type solid electrolytic capacitor includes a plurality of solid electrolytic capacitor units, each of which has an anode part and a cathode part connected to the anode part, characterized in that the anode part is formed with at least one buffering via-hole in a welding area thereof. When each of the anode parts is compressed in a welding process, the volume of the corresponding buffering via-hole decreases accordingly. Therefore, the soldering performance of the anode part solid electrolytic capacitor is enhanced and the connection stability is increased.

Long-term packaging for the protection of implant electronics

The present invention provides a micropackaged device comprising: a substrate for securing a device; a corrosion barrier affixed to said substrate; optionally at least one feedthrough disposed in said substrate to permit at least one input and or at least one output line into said micropackaged device; and an encapsulation material layer configured to encapsulate the micropackaged device.

Capacitor with insulation composition showing thermo-reversible oil-to-gel-transition

A wet capacitor is provided, and the use of an insulation fluid composition in such a capacitor. The capacitor includes a package of a metal foil and a polymeric insulating film, or of a metallized polymeric film, wherein the insulation composition includes a synthetic or natural aromatic oil and a polymer. The insulation composition is configured to undergo a thermo-reversible oil-to-gel transition at a predefined gel-point temperature. Further, methods of producing such wet capacitors are provided, optionally including additional filling materials, and methods of sealing leaks in such capacitors.

Capacitor with insulation composition showing thermo-reversible oil-to-gel-transition

A wet capacitor is provided, and the use of an insulation fluid composition in such a capacitor. The capacitor includes a package of a metal foil and a polymeric insulating film, or of a metallized polymeric film, wherein the insulation composition includes a synthetic or natural aromatic oil and a polymer. The insulation composition is configured to undergo a thermo-reversible oil-to-gel transition at a predefined gel-point temperature. Further, methods of producing such wet capacitors are provided, optionally including additional filling materials, and methods of sealing leaks in such capacitors.