An electronic component includes: an ESD discharge member including a substrate having first and second surfaces opposing each other, first and second through-holes penetrating through the substrate, and first and second conductors; and a multilayer capacitor disposed on the first surface of the substrate, in which the multilayer capacitor may include: a capacitor body; and first and second external electrodes disposed outside the capacitor body and connected to the first and second conductors, respectively, and the first and second conductors may include first and second via electrodes coated on inner walls of the first and second through-holes, respectively.

An electrical device for a converter has at least one capacitor having a first connection and a second connection, a first busbar and a second busbar is disclosed. A respective busbar has a greater extension along a transverse direction than along a longitudinal direction, and has a greater extension along the longitudinal direction than along a vertical direction. The respective busbar has a first surface and a second surface which are opposite one other with respect to the vertical direction. The device also has a first contact-connection device electrically conductively contact-connected to the first connection and via which the first connection is electrically conductively connected to the first busbar, and a second contact-connection device electrically conductively contact-connected to the second connection via which the second connection is electrically conductively connected to the second busbar. The busbars delimit a connection space in the vertical direction for connecting a semiconductor power unit.

Micro-isolators exhibiting enhanced isolation breakdown voltage are described. The micro-isolators may include an electrically floating ring surrounding one of the isolator elements of the micro-isolator. The isolator elements may be capacitor plates or coils. The electrically floating ring surrounding one of the isolator elements may reduce the electric field at the outer edge of the isolator element, thereby enhancing the isolation breakdown voltage.

Micro-isolators exhibiting enhanced isolation breakdown voltage are described. The micro-isolators may include an electrically floating ring surrounding one of the isolator elements of the micro-isolator. The isolator elements may be capacitor plates or coils. The electrically floating ring surrounding one of the isolator elements may reduce the electric field at the outer edge of the isolator element, thereby enhancing the isolation breakdown voltage.

Micro-isolators exhibiting enhanced isolation breakdown voltage are described. The micro-isolators may include an electrically floating ring surrounding one of the isolator elements of the micro-isolator. The isolator elements may be capacitor plates or coils. The electrically floating ring surrounding one of the isolator elements may reduce the electric field at the outer edge of the isolator element, thereby enhancing the isolation breakdown voltage.

Micro-isolators exhibiting enhanced isolation breakdown voltage are described. The micro-isolators may include an electrically floating ring surrounding one of the isolator elements of the micro-isolator. The isolator elements may be capacitor plates or coils. The electrically floating ring surrounding one of the isolator elements may reduce the electric field at the outer edge of the isolator element, thereby enhancing the isolation breakdown voltage.

An electronic component includes: an insulating substrate including a first main surface and a second main surface opposite to each other in a thickness direction and a side surface with a plurality of ground electrodes exposed thereto; conductive films each covering a surface of a corresponding one of the plurality of ground electrodes exposed to the side surface of the insulating substrate; and a shielding film covering the first main surface and the side surface of the insulating substrate and surfaces of the conductive films. The plurality of ground electrodes includes a first ground electrode and a second ground electrode, the first ground electrode and the second ground electrode being exposed to the side surface of the insulating substrate at a position closest to the first main surface and at a position closest to the second main surface, respectively.

A multilayer ceramic electronic component includes a multilayer ceramic electronic component main body, first and second metal terminals, an exterior material covering the multilayer ceramic electronic component main body, a portion of the first metal terminal, and a portion of the second metal terminal, and an electrostatic shielding metal embedded in the exterior material and covering at least a portion of the multilayer ceramic electronic component main body. The electrostatic shielding metal is between a surface of the exterior material and a surface of the multilayer ceramic electronic component main body, and is spaced away from the multilayer ceramic electronic component main body.

A multilayer ceramic electronic component includes a multilayer ceramic electronic component main body, first and second metal terminals, an exterior material covering the multilayer ceramic electronic component main body, a portion of the first metal terminal, and a portion of the second metal terminal, and an electrostatic shielding metal embedded in the exterior material and covering at least a portion of the multilayer ceramic electronic component main body. The electrostatic shielding metal is between a surface of the exterior material and a surface of the multilayer ceramic electronic component main body, and is spaced away from the multilayer ceramic electronic component main body.

An electronic component includes a capacitor body having alternately stacked first and second internal electrodes with dielectric layers therebetween, the capacitor body having first to sixth surfaces and the first internal electrodes and the second internal electrodes being exposed through the third surface and the fourth surface, respectively. First and second external electrodes are disposed respectively on the third and fourth surfaces of the body and respectively connected to the first and second internal electrodes. A shielding layer includes a cap portion disposed on the second surface of the capacitor body and a side wall portion disposed on the third, fourth, fifth, and sixth surfaces of the capacitor body, and an insulating layer is disposed between the capacitor body and the shielding layer. The shielding layer consists of first and second shielding layers offset from each other in a direction connecting the third and fourth surfaces.