A method of producing a multi-layer ceramic electronic component includes: producing a multi-layer unit including ceramic layers that are laminated in a first direction, internal electrodes that are disposed between the ceramic layers, and a side surface that faces in a second direction orthogonal to the first direction, the internal electrodes being exposed on the side surface; sintering the multi-layer unit; and forming a side margin on the side surface of the sintered multi-layer unit.

A multilayer electronic component includes a body having a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween. The body has a hexahedral shape. A first external electrode includes a first connection portion disposed on a third surface, and first and third band portions extending from the first connection portion respectively onto a portion of a first and a second surface. A second external electrode includes a second connection portion disposed on a fourth surface, and second and fourth band portions extending from the second connection portion respectively onto a portion of the first and second surfaces. An insulating layer including an oxide containing hafnium is disposed on the first and second connection portions and covers the second surface and the third and fourth band portions. First and second plating layers are disposed respectively on the first and second band portions.

A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, and third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface, and a third band portion extending from the first connection portion to a portion of the second surface; a second external electrode including a second connection portion disposed on the fourth surface, and a fourth band portion extending from the second connection portion to a portion of the second surface; an insulating layer disposed on the first and second connection portions and covering the second surface and the third and fourth band portions; the insulating layer includes an oxide including zirconium (Zr).

A multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, the capacitor body having first to sixth surfaces, the first internal electrode being exposed through the third, fifth, and sixth surfaces, and the second internal electrode being exposed through the fourth, fifth, and sixth surfaces, a first side portion and a second side portion, respectively disposed on the fifth surface and the sixth surface of the capacitor body, and a first external electrode and a second external electrode, respectively be connected to the first internal electrode and the second internal electrode. The first and second side portions comprise an acicular second phase including a glass comprising aluminum (Al) and silicon (Si), manganese (Mn), and phosphorus (P), and a volume of the second phase is 30% or more with respect to the entire first and second side portions.

A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and first and second internal electrodes alternately stacked with respective dielectric layers interposed therebetween; and a first external electrode connected to the first internal electrodes and a second external electrode connected to the second internal electrodes, wherein the dielectric layer includes silicon (Si), each of the first and second internal electrodes includes Si and a conductive metal, and a ratio (B/A) of an average content (B) (wt %) of Si included in each of the first and second internal electrodes to an average content (A) (wt %) of Si included in the dielectric layer is 0.99 or more and 1.41 or less.

A multilayer ceramic electronic component includes a multilayer body including layered ceramic layers and having a rectangular parallelepiped shape, and first and second outer electrodes covering both end surfaces of the multilayer body and extending from both the end surfaces so as to cover at least portions of a first main surface, a second main surface, a first side surface, and a second side surface of the multilayer body. An insulating layer is provided on a surface of the first main surface of the multilayer body. The first outer electrode and the second outer electrode disposed on the first main surface side are disposed on the insulating layer.

A ceramic electronic device includes: a multilayer chip having a multilayer structure and a cover layer, the multilayer structure having a structure in which each of dielectric layers and each of internal electrode layers are alternately stacked, respective one ends of the plurality of internal electrode layers being alternately exposed to a first end face and a second end face of the multilayer structure, the cover layer being provided on each of an upper face and a lower face of the multilayer structure in a stacking direction of the multilayer structure, a main component of the cover layer being ceramic, wherein in each of two side faces of the multiplayer structure, a color of a first region is different from a color of a second region that is positioned at a height different from the first region in the stacking direction.

A ceramic electronic component includes an element body including a first internal electrode, a second internal electrode disposed in parallel to the first internal electrode, and a dielectric interposed between the first and second internal electrodes and surrounding them, and external electrode electrically connected to ends of the internal electrodes. The element body has a bottom surface on which respective ends of the first and second internal electrodes are exposed and a top surface. The dielectric has bottom dielectric regions adjacent to the bottom surface, a top dielectric region adjacent to the top surface, and a middle height dielectric region disposed between the bottom and top dielectric region. The bottom dielectric regions have a ratio of the concentration of one or more group 14 elements to the concentration of one or more group 2 elements that is higher than that in the top dielectric region.

Provided is a dielectric ceramic composition including a first component and a second component, wherein the first component comprises an oxide of Ca of 0.00 mol % to 35.85 mol % an oxide of Sr of 0.00 mol % to 47.12 mol %, an oxide of Ba of 0.00 mol % to 51.22 mol %, an oxide of Ti of 0.00 mol % to 17.36 mol %, an oxide of Zr of 0.00 mol % to 17.36 mol %, an oxide of Sn of 0.00 mol % to 2.60 mol %, an oxide of Nb of 0.00 mol % to 35.32 mol %, an oxide of Ta of 0.00 mol % to 35.32 mol %, and an oxide of V of 0.00 mol % to 2.65 mol %, and the second component includes at least (a) an oxide of Mn of 0.005% by mass to 3.500% by mass and (b) an oxide of Cu and/or an oxide of Ru.

A multi-layer ceramic capacitor includes: a first region including a polycrystal including, as a main component, crystal grains free from intragranular pores; a second region that includes a polycrystal including, as a main component, crystal grains including intragranular pores and includes a higher content of silicon than a content of silicon in the first region; a capacitance forming unit including ceramic layers laminated along a first direction, and internal electrodes disposed between the ceramic layers; and a protective portion including a cover that covers the capacitance forming unit and constitutes a main surface facing in the first direction, a side margin constituting a side surface facing in a second direction orthogonal to the first direction, and a ridge constituting a connection portion, the connection portion connecting the main surface and the side surface to each other. The ceramic layers include the first region. The ridge includes the second region.