The present invention provides a resin composition comprising: 1 to 20 parts by weight of a reinforcing fiber; 0.2 to 5 parts by weight of an anti-settling agent; 20 to 40 parts by weight of an epoxy resin; 0.1 to 3 parts by weight of a curing agent; and 50 to 75 parts by weight of a high dielectric constant filler. The present invention further provides a dielectric layer produced from the resin composition and a capacitor comprising the dielectric layer. In the dielectric layer made from the resin composition provided by the present invention, the fibers can be evenly dispersed and can enhance the mechanical strength of the resin composition, and cooperate with the epoxy resin to bring excellent toughness. Therefore, the mechanical strength of the produced dielectric layer can be remarkably improved, and its fragility can be effectively overcome when the dielectric layer is used in the PCB double-side etching process.

An aerogel capacitor includes: a substrate including a capacitor structure including an aerogel, a dielectric layer and a conductive layer, and a support surrounding the capacitor structure; and an electrode unit including a first electrode and a second electrode provided on the substrate. The first electrode is connected to the aerogel and the second electrode is connected to the conductive layer.

An aerogel capacitor includes: a substrate including a capacitor structure including an aerogel, a dielectric layer and a conductive layer, and a support surrounding the capacitor structure; and an electrode unit including a first electrode and a second electrode provided on the substrate. The first electrode is connected to the aerogel and the second electrode is connected to the conductive layer.

A capacitor comprises an electrically conductive cylinder, an electrically conductive or semi-conductive cylindrical shell or shell segment arranged concentrically around the electrically conductive cylinder, and a dielectric arranged between the electrically conductive cylinder and the electrically conductive or semi-conductive cylindrical shell or shell segment. The dielectric comprises a particulate composite including a matrix material having a non-zero (e.g. negative) thermal coefficient of relative permittivity and a particulate filler material blended with the matrix material, the particulate filler material having an opposite (e.g. positive thermal) coefficient of relative permittivity. The positive thermal coefficient of relative permittivity is thereby selected such that the capacitance value of the capacitor is constant within a stability margin over a predefined temperature interval.

A structural capacitor having a plurality of planar dielectric layers and a plurality of positive and negative electrodes with the positive and negative electrodes alternating between each dielectric layer. First and second spaced apart holes are provided through each dielectric layer as well as the electrodes so that the first holes in the electrodes register with the first holes in the dielectric layer and likewise for the second holes. The capacitor is formed by stacking the dielectric layers and electrodes on two spaced apart alignment pins with a positive alignment pin extending through the first holes and a negative alignment pin extending through the second holes in the dielectric layers and electrodes. These alignment pins maintain layer alignment during subsequent thermal and pressure processing to bond together the dielectric and electrode layers into an integral structural material. After processing, the alignment pins are removed and replaced with electrode pins, where the positive electrode pin is in electrical contact only with the positive electrodes and the negative electrode pin is in electrical contact only with the negative electrodes. The electrode pins are used for subsequent electrical and mechanical connectorization to the structural capacitor.

A structural capacitor having a plurality of planar dielectric layers and a plurality of positive and negative electrodes with the positive and negative electrodes alternating between each dielectric layer and methods for making structural capacitors are provided. First and second spaced apart holes are provided through each dielectric layer as well as the electrodes so that the first holes in the electrodes register with the first holes in the dielectric layer and likewise for the second holes. The capacitor is formed by stacking the dielectric layers and electrodes on two spaced apart alignment pins with a positive alignment pin extending through the first holes and a negative alignment pin extending through the second holes in the dielectric layers and electrodes. These alignment pins maintain layer alignment during subsequent thermal and pressure processing to bond together the dielectric and electrode layers into an integral structural material. After processing, the alignment pins are removed and replaced with electrode pins, where the positive electrode pin is in electrical contact only with the positive electrodes and the negative electrode pin is in electrical contact only with the negative electrodes. The electrode pins are used for subsequent electrical and mechanical connectorization to the structural capacitor.

Disclosed are an insulating material (high-k layer) which includes a fiber assembly mainly composed of a cellulose nanofiber, and an electroconductive metal material supported by the fiber assembly; and a passive element (capacitor) which includes a high-k layer which is composed of the insulating material, and an electroconductive part stacked on the high-k layer.

A laminate includes a first outer copper layer; a second outer copper layer; a multilayer construct having at least three polymer films disposed between the first and second outer copper layers. Adjacent ones of the at least three polymer layers have dissimilar dielectric constant, Dk, values, dissimilar thicknesses, or preferably both dissimilar Dk values and dissimilar thicknesses. Adjacent ones of the first and second outer copper layers, and the at least three polymer layers, are bonded to each other. Each polymer film of the at least three polymer films has a voltage breakdown strength equal to or greater than 200 kV/mm, or equal to or greater than 5 kV at a film thickness of 25 micrometers.