An electrolytic capacitor that includes a resin molding that includes a capacitor element including an anode, a dielectric layer, and a cathode, a sealing resin sealing the capacitor element; a first external electrode on a first end surface of the resin molding; and a second external electrode on a second end surface and connected to the cathode exposed at the second end surface of the resin molding, wherein when viewed in a thickness direction perpendicular to the length direction, the anode includes a first anode region having a first outer edge exposed at the first end surface and connected to the first external electrode, and a second anode region having a second outer edge positioned closest to the second external electrode in the length direction, and a length of the first outer edge is greater than a length of the second outer edge in a width direction.

A monitoring system includes a capacitor can having one or more capacitors. The monitoring system includes an antenna. The monitoring system includes at least one sensor disposed within the capacitor can and configured to detect an operating characteristic associated with health of the one or more capacitors of the capacitor can. The monitoring system includes a processor configured to receive a first signal from the at least one sensor indicative of the operating characteristic. The processor is configured to send a second signal, via the antenna, indicative of a value of the operating characteristic to a receiving device outside of the capacitor can.

A capacitor element includes an anode body including a porous region located at a surface of the anode body, a dielectric layer that covers at least a part of the anode body, and a cathode layer that covers at least a part of the dielectric layer. The anode body includes an anode part and a cathode formation part on which the cathode layer is disposed, the cathode formation part being adjacent to the anode part. At least a part of the porous region of the anode part includes a thin-thickness region that is thinner than the porous region in the cathode formation part, and a metal substrate is stacked on at least a part of the thin-thickness region. The metal substrate is denser than the porous region in the cathode formation part.

A capacitor element includes an anode body including a porous region located at a surface of the anode body, a dielectric layer that covers at least a part of the anode body, and a cathode layer that covers at least a part of the dielectric layer. The anode body includes an anode part and a cathode formation part on which the cathode layer is disposed, the cathode formation part being adjacent to the anode part. At least a part of the porous region of the anode part includes a thin-thickness region that is thinner than the porous region in the cathode formation part, and a metal substrate is stacked on at least a part of the thin-thickness region. The metal substrate is denser than the porous region in the cathode formation part.

An electrolytic capacitor that includes a stack having multiple capacitor elements stacked in a thickness direction perpendicular to a length direction, wherein a first end of a first cathode is first closest to a second external electrode among all of ends of the cathodes of the multiple capacitor elements, a second end of a second cathode is second closest to the second external electrode, and an end of the second external electrode is closer to a first external electrode than the second end of the second cathode.

Photocurable compositions that combine redox-active semiconducting organic polymers with photocurable organic molecules are provided. Upon exposure to radiation, the photocurable compositions form ion-permeable, electrically conductive crosslinked organic films that can be used as conducting channels in n-channel or p-channel organic electrochemical transistors, including vertical organic electrochemical transistors (vOECTs). The vOECTs can be incorporated in complementary electronic circuits.

Photocurable compositions that combine redox-active semiconducting organic polymers with photocurable organic molecules are provided. Upon exposure to radiation, the photocurable compositions form ion-permeable, electrically conductive crosslinked organic films that can be used as conducting channels in n-channel or p-channel organic electrochemical transistors, including vertical organic electrochemical transistors (vOECTs). The vOECTs can be incorporated in complementary electronic circuits.

A hybrid power supply circuit, a method using a hybrid power supply circuit and method for producing a hybrid power supply circuit are disclosed. In an embodiment a hybrid power-supply circuit includes a first energy-storage device and a second energy-storage device, wherein the first and second energy-storage devices are combined in a module and electrically interconnected, and wherein the first energy-storage device is a solid-state accumulator.

A power converter includes a PCB having opposing first and second sides, and a plurality of first commutation units and first capacitor unit disposed on the PCB. Each first commutation unit includes a first discrete component and a second discrete component. The second end of the first discrete component is electrically coupled to the first end of the second discrete component, and the first capacitor unit is electrically coupled to the first ends of the first discrete components and the second ends of the second discrete components in the plurality of first commutation units, respectively. The first discrete components and the second discrete components in the plurality of first commutation units are arranged in a row. The first discrete component and the second discrete component in each first commutation unit form a commutation loop together with the first capacitor unit.

Apparatuses, systems, and methods for coupling a capacitor to a printed circuit board assembly. One example apparatus can include a number of capacitors and a connector coupled to the number of capacitors, the connector configured to removably couple the number of capacitors to a printed circuit board assembly of a solid state drive.