Provided is a tape-shaped contact member including a tape-shaped contact material. At least one wire-shaped brazing material is bonded to the tape-shaped contact material, at least one projection including the brazing material and protruding from a surface of the contact material is formed in a cross-sectional shape, a diffusion region containing a metal component forming the brazing material is formed along an interface with the brazing material inside the contact material, and the diffusion region has a thickness of 2 μm or more and 10 μm or less. A chip-shaped contact component can be obtained by cutting the tape-shaped contact member to an arbitrary length. The present contact component is useful as a constituent member for a switching electrical contact, and capable of adapting to height reduction of the electrical contact. The present invention can also contribute to reduction of occurrence of poor bonding.

A contact for a vacuum interrupter of a low, medium or high-voltage switchgear includes a contact rod composed of a first electrically conductive material and extending along a longitudinal axis of the contact, and a contact piece composed of a second electrically conductive material and fastened to an end face of the contact rod. The contact rod and the contact piece are materially bonded to one another at a connecting face. At least one of the contact rod or the contact piece has a wall which delimits the connecting face, rises perpendicularly to the longitudinal axis and is disposed such that the contact piece and the contact rod are also force-lockingly connected to one another by a force acting transversely to the longitudinal axis between the contact piece and the contact rod. A production method for such a contact is also provided.

Provided is a tape-shaped contact member including a tape-shaped contact material. At least one wire-shaped brazing material is bonded to the tape-shaped contact material, at least one projection including the brazing material and protruding from a surface of the contact material is formed in a cross-sectional shape, a diffusion region containing a metal component forming the brazing material is formed along an interface with the brazing material inside the contact material, and the diffusion region has a thickness of 2 ?m or more and 10 ?m or less. A chip-shaped contact component can be obtained by cutting the tape-shaped contact member to an arbitrary length. The present contact component is useful as a constituent member for a switching electrical contact, and capable of adapting to height reduction of the electrical contact. The present invention can also contribute to reduction of occurrence of poor bonding.

A method for forming a contact piece for a circuit breaker, the contact piece comprising a reinforcement phase and a conductive phase, the method comprising: providing a slurry of the reinforcement phase in liquid; freeze casting the slurry, to form a cast comprising a frozen liquid structure and a reinforcement phase structure; removing the frozen liquid structure from the cast, to form a foam comprising the reinforcement phase structure; sintering the foam, to form a sintered foam; and infiltrating the sintered foam with the conductive phase, to form a piece part.

A contact carrier serves for fastening a contact element of a low-voltage protective switching device by a soldering operation, so that a solder layer is formed between the contact carrier and the contact element. The contact carrier has a contacting area for the solder layer, the contacting area for its part having a rough surface structure and being delimited by a first groove-like depression. As a result of the rough surface structure of the contacting area and the first groove-like depression, when the contact element is being fixed on the contact carrier by soldering, the solder flux can be specifically influenced to the effect that rising up of the solder at the sides of the contact element is avoided, or at least significantly reduced. The quality of the soldered connection, and consequently the reliability of the soldering process, are significantly improved in this way.