There is provided a composite plating material and a related technique thereof, the composite plating material including: a base material, and a composite plating layer on the base material, the composite plating layer comprising a composite material containing carbon particles and Sb in an Ag layer, with a carbon content of 6.0 mass % or more and a Sb content of 0.5 mass % or more.

A method for producing an electrical switch contact arrangement for a vacuum circuit breaker includes the following steps: a) providing two electrical contact pieces made of copper or a copper alloy; b) coating the electrical contact pieces with aluminum or an aluminum alloy, the coating of the contact pieces taking place by means of a cold gas spraying method; c) welding each of the sides coated in method step b) to a current transfer contact; and d) arranging the units obtained in method step b) inside the vacuum circuit breaker. There is also described an electrical switch contact arrangement for a vacuum circuit breaker with the contact pieces produced by the method according to the invention.

A method for producing an electrical switch contact arrangement for a vacuum circuit breaker includes the following steps: a) providing two electrical contact pieces made of copper or a copper alloy; b) coating the electrical contact pieces with aluminum or an aluminum alloy, the coating of the contact pieces taking place by means of a cold gas spraying method; c) welding each of the sides coated in method step b) to a current transfer contact; and d) arranging the units obtained in method step b) inside the vacuum circuit breaker. There is also described an electrical switch contact arrangement for a vacuum circuit breaker with the contact pieces produced by the method according to the invention.

Embodiments in accordance with the present disclosure are directed to sensor apparatuses utilizing a one-piece thermal isolated fitting (TIF) tube and methods of assembling the same. In a particular embodiment, a sensor apparatus includes a one-piece thermal isolated fitting (TIF) tube that includes a cylindrical shaped body portion and a flange at one end of the TIF tube. In this example embodiment, the flange has a top surface that is facing away from the cylindrical shaped body portion and an underside surface that is facing towards the cylindrical shaped body portion.

Embodiments in accordance with the present disclosure are directed to sensor apparatuses utilizing a one-piece thermal isolated fitting (TIF) tube and methods of assembling the same. In a particular embodiment, a sensor apparatus includes a one-piece thermal isolated fitting (TIF) tube that includes a cylindrical shaped body portion and a flange at one end of the TIF tube. In this example embodiment, the flange has a top surface that is facing away from the cylindrical shaped body portion and an underside surface that is facing towards the cylindrical shaped body portion.

An embodiment modular light-emitting diode (LED) display panel includes attachment points for use in attachment as part of a multi-panel modular LED display, a printed circuit board including a first side and an opposite second side, and a plastic casing attached to the opposite second side of the printed circuit board. A perimeter of the plastic casing is substantially rectangular and has a height and a width. The modular LED display panel further includes a display surface including a plurality of LEDs arranged as pixels and attached to the first side of the printed circuit board. The pixels are arranged in a rectangular array including at least fifty pixels. Each of the pixels of the rectangular array is spaced from each respective adjacent pixel of the rectangular array by a pitch. The pitch is a predetermined constant number. The pitch does not depend on the height and the width.

An embodiment modular light-emitting diode (LED) display panel includes attachment points for use in attachment as part of a multi-panel modular LED display, a printed circuit board including a first side and an opposite second side, and a plastic casing attached to the opposite second side of the printed circuit board. A perimeter of the plastic casing is substantially rectangular and has a height and a width. The modular LED display panel further includes a display surface including a plurality of LEDs arranged as pixels and attached to the first side of the printed circuit board. The pixels are arranged in a rectangular array including at least fifty pixels. Each of the pixels of the rectangular array is spaced from each respective adjacent pixel of the rectangular array by a pitch. The pitch is a predetermined constant number. The pitch does not depend on the height and the width.

A part of a current path is for an electric switching device. In an embodiment, the part of the current path was produced in layers by way of a 3D printing method.

A part of a current path is for an electric switching device. In an embodiment, the part of the current path was produced in layers by way of a 3D printing method.

A silver-plated product having a higher hardness and more excellent wear resistance than those of conventional silver-plated products, and a method for producing the same. In a method for producing a silver-plated product by forming a surface layer of silver on a base material by electroplating at a current density in a silver-plating solution which is an aqueous solution containing silver potassium cyanide or silver cyanide, potassium cyanide or sodium cyanide, and a benzimidazole (such as 2-mercaptobenzmimidazole or 2-mercaptobenzimidazole sulfonic acid sodium salt dihydrate), the ratios of the concentrations of silver potassium cyanide or silver cyanide, potassium cyanide or sodium cyanide, and the imidazole to the current density during the silver-plating (or the ratios of the concentrations of silver potassium cyanide or silver cyanide and the imidazole to the current density during the silver plating, and the concentration of potassium cyanide or sodium cyanide) are set to be predetermined ranges, respectively.