A stud assembly is assembled by inserting a sphere into a cavity of a stud, where the cavity is cylindrical in shape, inserting a neck of a rivet into the cavity until the neck touches the sphere, and press-fitting the rivet into the cavity until the neck melds with the sphere.

A method for producing an electrical contact assembly includes. Providing a contact carrier of a first conductive material, the contact carrier having at least one depression or an aperture. Furthermore, a contact material support of a second conductive material is provided. This contact material support is pressed in the depression or the aperture while at the same time applying an electrical welding voltage to the contact material support and the contact carrier, a pressing-force/welding-current/time profile being chosen such that the contact carrier and the contact material support form a connection including interlocking and/or frictional engagement and a connection including material bonding in one working step.

A switching device includes a housing, an operation member, a plurality of fixed contacts, a plurality of movable contacts, and a snap action mechanism for causing the movable contacts to operate. The snap action mechanism includes a plurality of first drivers in each of which a fulcrum that serves as a pivot point is formed on one end side of a given first driver and in which a given movable contact from among the movable contacts is provided on another end side of the given first driver; a second driver in which a pressing member to be pressed through the operation member is formed on one end side of the second driver and in which fulcrums that serve as pivot points are each formed on another end side of the second driver; and a coupling member integrally coupling the plurality of first drivers to constitute a first drive member.

A switching device includes a housing, an operation member, a plurality of fixed contacts, a plurality of movable contacts, and a snap action mechanism for causing the movable contacts to operate. The snap action mechanism includes a plurality of first drivers in each of which a fulcrum that serves as a pivot point is formed on one end side of a given first driver and in which a given movable contact from among the movable contacts is provided on another end side of the given first driver; a second driver in which a pressing member to be pressed through the operation member is formed on one end side of the second driver and in which fulcrums that serve as pivot points are each formed on another end side of the second driver; and a coupling member integrally coupling the plurality of first drivers to constitute a first drive member.

A preparation method of a rapid bonding of a long silver-graphite electrical contact material and a solder strip material includes the following steps: first step, making a silver-graphite spindle into a silver-graphite electrical contact sheet material by an extrusion process; second step, performing a sintering to composite a solder strip material with the silver-graphite electrical contact sheet material to obtain a composite blank; and third step, performing a rolling and a heat treatment on the composite blank for one or more times to complete the composite of the long silver-graphite electrical contact material and the solder strip material. The method is a method for preparing a silver-based electrical contact material and solder composite material.

A preparation method of a rapid bonding of a long silver-graphite electrical contact material and a solder strip material includes the following steps: first step, making a silver-graphite spindle into a silver-graphite electrical contact sheet material by an extrusion process; second step, performing a sintering to composite a solder strip material with the silver-graphite electrical contact sheet material to obtain a composite blank; and third step, performing a rolling and a heat treatment on the composite blank for one or more times to complete the composite of the long silver-graphite electrical contact material and the solder strip material. The method is a method for preparing a silver-based electrical contact material and solder composite material.

An electrical contact assembly including an elongate stud having a coupling end and an opposing butt end, the butt end having a recess formed therein, the recess having a head portion and a shank portion defining a shoulder at a juncture therebetween, the head portion bounded by a collar and having a diameter that is larger than a diameter of the shank portion, and a contact pad having a head and a shank, the head having a top surface and a bottom surface with a tapered sidewall extending therebetween, the shank extending from the bottom surface of the head and having a diameter that is smaller than a diameter of the bottom surface, wherein the contact pad is disposed within the recess with the bottom surface of the head disposed on the shoulder and with the collar extending over and engaging the angled sidewall of the head.

An electric micro-switch has at least one electric contact. The contact has a profiled section. The profiled section has a longitudinal extension, a bent portion formed in the longitudinal extension and having an outer surface that is, at least in section, formed in a rounded manner. A contact region is defined on the outer surface of the bent portion. A method for manufacturing the micro-switch is also disclosed.

An electrical contact assembly including an elongate stud having a coupling end and an opposing butt end, the butt end having a recess formed therein, the recess having a head portion and a shank portion defining a shoulder at a juncture therebetween, the head portion bounded by a collar and having a diameter that is larger than a diameter of the shank portion, and a contact pad having a head and a shank, the head having a top surface and a bottom surface with a tapered sidewall extending therebetween, the shank extending from the bottom surface of the head and having a diameter that is smaller than a diameter of the bottom surface, wherein the contact pad is disposed within the recess with the bottom surface of the head disposed on the shoulder and with the collar extending over and engaging the angled sidewall of the head.

An arc-ablation resistant tungsten alloy switch contact and preparation method is disclosed. A contact member has a three-layer structure, wherein a first layer is a hydrophobic rubber layer, a second layer is a sheet metal layer, and a third layer is a tungsten alloy chemical deposition layer. A plating bath adopted in the chemical deposition contains 25-125 g/L soluble tungsten compound, 0-60 g/L soluble compound of a transition metal like ferrum, nickel, cobalt, copper or manganese, and 0-30 g/L soluble compound of tin, stibium, lead or bismuth. When a layered complex of the hydrophobic rubber layer and the sheet metal layer is chemically plated by the plating bath, a tungsten alloy plated layer is selectively deposited on a metal surface, and chemical deposition of the tungsten alloy does not occur on a surface of the hydrophobic rubber fundamentally.