This protective element includes a fusible conductor (1a), three or more electrodes (2a), (2b), (2c) electrically connected to each other via the fusible conductor (1a), and a heating element configured to heat and fuse the fusible conductor (1a).

An electronic device includes an input, an output, a metal fuse, a resistor, a heat control transistor, and a heat controller. The metal fuse is coupled between the input and the output. The resistor is coupled between the metal fuse and the heat control transistor. The heat control transistor is coupled between the resistor and a reference terminal of the electronic device, and the heat controller is configured to control a heater current of the heat control transistor.

A three phase surge protection device is disclosed. In an embodiment a device include a stack comprising a first varistor, a second varistor and a third varistor, wherein the varistors are electrically connected to form a circuit and a first thermal disconnect configured to interrupt the circuit when a temperature of the first thermal disconnect exceeds a predefined temperature.

A fluid connector for coolant includes a chamfered lip and a fir tree circumferentially aligned with at least one O-ring on an outer body of the fluid connector. The fluid connector is configured to receive an end piece. The end piece has a standard SAEJ2044 end form. The fluid connector utilizes a housing to form a ribbing and support a seal. An integrated inverter assembly includes a main cover and an opposing back cover; a coolant channel disposed between a coolant channel cover and a coolant channel separating body; wherein power electronics of the integrated inverter assembly are thermally coupled to the coolant channel; wherein at least one of a coolant inlet or a coolant outlet of the coolant channel comprises a fluid connector; and wherein the fluid connector comprises a chamfered lip on an end of the fluid connector.

An electronic device includes an input, an output, a metal fuse, a resistor, a heat control transistor, and a heat controller. The metal fuse is coupled between the input and the output. The resistor is coupled between the metal fuse and the heat control transistor. The heat control transistor is coupled between the resistor and a reference terminal of the electronic device, and the heat controller is configured to control a heater current of the heat control transistor.

An integrated inverter assembly with turbulent flow and increased heat transfer includes an integrated coolant coupling port with a ribbed interior surface; a fluid connector having a chamfered lip and a fir tree circumferentially aligned with at least one O-ring on an outer body of the fluid connector; and a baffled hose configured to couple the integrated coolant coupling port with the fluid connector, wherein the baffled hose provides for compliance in a horizontal plane and a vertical plane.

A protection element includes a first electrode (1), a second electrode (2) having a spring property, and a fuse element material (3) that is disposed between the first electrode and the second electrode, in which the fuse element material (3) is supported by being interposed between the first electrode (1) and the second electrode (2) in a bent state.

An inverter assembly includes an integrated coolant coupling port; a fluid connector having a chamfered lip and a fir tree circumferentially aligned with at least one O-ring on an outer body of the fluid connector; and a flexible hose configured to couple the integrated coolant coupling port to the fluid connector.

An integrated inverter assembly with turbulent flow and increased heat transfer includes an integrated coolant coupling port with a ribbed interior surface; a fluid connector having a chamfered lip and a fir tree circumferentially aligned with at least one O-ring on an outer body of the fluid connector; and a baffled hose configured to couple the integrated coolant coupling port with the fluid connector, wherein the baffled hose provides for compliance in a horizontal plane and a vertical plane.

A method comprises: forming a first metallization layer on a semiconductor die, the first metallization layer including a metal fuse; and forming a second metallization layer on the first metallization layer, in which the second metallization layer includes a thermal conductor spaced from the metal fuse, and the first metallization layer is between the second metallization layer and the semiconductor die.