Disclosed are various protection devices and associated methods. In some embodiments, a protection device may include a substrate and a fusible element coupled to the substrate, wherein the fusible element may include a first end opposite a second end, and wherein the first and second ends wrap around the substrate. The fusible element may further include a central section comprising a plurality of segments connected end-to-end in a continuous arrangement between the first and second ends, wherein a first set of segments of the plurality of segments extends along a first plane, and wherein a second set of segments of the plurality of segments extends along a second plane, different than the first plane.

A multi layer fuse device includes a substrate and an elongated fuse element, having a pair of contact pads formed therewith at opposed longitudinal ends thereof formed on one surface of the substrate. A pair of passivation layers are provided covering the fuse and contact pads. Windows may be opened through both passivation layers above both of the contact pads, and conductive electrode material is electroplated through the windows to contact the contact pads and to extend partially above a top surface of the passivation layers. Exposed electroplated material may be coated with solderable conductive material or a surface mount termination may be provided. Electroplated material may cover a portion of the fuse surface prior to application of the passivation layers and extend to an end of the substrate so that windows are not required.

A fuse holder includes a holder base comprising a plurality of protrusions each having a mounting hole formed therein to provide for mounting of the holder base to an external component and one or more mating protrusions and one or more mating slots formed on each of opposing side surfaces. The fuse holder also includes an input stud coupled to or formed on the holder base and a cover configured to attach to the holder base to at least partially enclose one or more fuses positionable on the fuse holder. The one or more mating protrusions and the one or more mating slots formed on each of the opposing side surfaces of the holder base comprise dovetailed protrusions and slots of a matching profile capable of receiving such a dovetailed protrusion, so as to enable a side-by-side stacking and interlocking of fuse holders with such mating protrusions and mating slots.

A high breaking capacity chip fuse including a bottom insulative layer, a first intermediate insulative layer, a second intermediate insulative layer, and a top insulative layer disposed in a stacked arrangement in the aforementioned order, a fusible element disposed between the first and second intermediate insulative layers and extending between electrically conductive first and second terminals at opposing longitudinal ends of the bottom insulative layer, the first intermediate insulative layer, the second intermediate insulative layer, and the top insulative layer, wherein the first and second intermediate insulative layers are formed of porous ceramic.

A surface-mountable thin-film fuse component is disclosed that may include a substrate having a top surface, a first end, and a second end that is spaced apart from the first end in a longitudinal direction. The thin-film component may include a fuse layer formed over the top surface of the substrate. The fuse layer may include a thin-film fuse track. An external terminal may be disposed along the first end of the substrate and electrically connected with the thin-film fuse track. The external terminal may include a compliant layer comprising a conductive polymeric composition.

A method for manufacturing a chip fuse, comprises: a liquid film forming step for forming a liquid film of dispersion liquid having metal nanoparticles dispersed therein on a principal surface of a substrate; a fuse film forming step for forming a fuse film on the principal surface by irradiating the liquid film with laser light; and a first terminal forming step for forming first terminals that each connects to the fuse film on each of both end sides in a longitudinal direction of the fuse film on the principal surface.

A high breaking capacity chip fuse including a bottom insulative layer, a first intermediate insulative layer, a second intermediate insulative layer, and a top insulative layer disposed in a stacked arrangement in the aforementioned order, a fusible element disposed between the first and second intermediate insulative layers and extending between electrically conductive first and second terminals at opposing longitudinal ends of the bottom insulative layer, the first intermediate insulative layer, the second intermediate insulative layer, and the top insulative layer, wherein the first and second intermediate insulative layers are formed of porous ceramic.

Current-limiting fuse comprising an electrically insulating housing with walls surrounding an interior space, with a first opening and with a second opening opposite to said first opening, and an integrally formed electrical conductor element extending from a first terminal area outside said housing, across said first opening, across said interior space, across said second opening and to a second terminal area outside said housing, wherein said conductor element comprises a melting section of reduced cross-section, said melting section being located in said interior space and being configured to melt, when a predefined maximum allowable electrical current in the conductor element is exceeded, and wherein a first sealing section of the conductor element seals said first opening and wherein a second sealing section of the conductor element seals said second opening. The invention is further directed to a method of manufacturing the current-limiting fuse.

A fuse element is a fuse element (1) including a flat plate-shaped blowout section (1e) with no through-hole disposed between a first terminal (20a) and a second terminal (20b), in which a width (1d) of the blowout section (1e) has a length equal to or greater than 80% of a width (2d) of each of joining portions joining the first terminal (20a) and the second terminal (20b) to the blowout section (1e). The width (1d) of the blowout section (1e) is preferably a length equal to or greater than 95% of the width (2d) of each of the joining portions.

A chip-type fuse includes a plated-shape fusible body (26). The fusible body (26) has internal electrodes (28 and 30) facing toward the center of the straight line from both ends of the straight line, respectively and has a fusible portion (32) formed between the internal electrodes (28 and 30) and integrated with them. The fusible body is housed into a casing (2). Protrusions (38 and 40) protrude from the parts of the both ends of the internal electrodes (28 and 30). The protrusions (38 and 40) are covered with plating layers (50 and 52).