H01J11/20

VACUUM EXHAUST METHOD

A vacuum exhaust method is for decreasing a pressure in a processing chamber in which a mounting table configured to mount thereon a substrate is provided by using a gas exhaust unit. The vacuum exhaust method includes mounting a non-evaporated getter (NEG) on the mounting table, and adsorbing an active gas in the processing chamber on the NEG mounted on the mounting table. In the adsorbing the active gas, the NEG is maintained at a predetermined temperature.

IMPLANTABLE MEDICAL DEVICE SELECTIVE ENCAPSULATION

Implantable medical devices including a housing that contains operational circuitry for the implantable medical device and a dispensed hydrogen getter. The hydrogen getter may include a getter carrier material and one or more getter materials carried as suspensions in the getter carrier material, with the getter materials taking the form of organic compounds, such as fatty acids, or powdered metal oxides, or combinations thereof. The hydrogen getter may instead be comprised of two fatty acids having different melt temperatures. The hydrogen getter may be dispensed onto an encapsulant layer or other component of the implantable medical device, or may be blended into an encapsulant layer.

IMPLANTABLE MEDICAL DEVICE SELECTIVE ENCAPSULATION

Implantable medical devices including a housing that contains operational circuitry for the implantable medical device and a dispensed hydrogen getter. The hydrogen getter may include a getter carrier material and one or more getter materials carried as suspensions in the getter carrier material, with the getter materials taking the form of organic compounds, such as fatty acids, or powdered metal oxides, or combinations thereof. The hydrogen getter may instead be comprised of two fatty acids having different melt temperatures. The hydrogen getter may be dispensed onto an encapsulant layer or other component of the implantable medical device, or may be blended into an encapsulant layer.

Frequency selective surfaces

A switchable Frequency Selective Surface (FSS) in which the switchable elements are Plasma-shells. Plasma-shells as described herein allow for control or reconfiguration of the FSS electromagnetic (EM) properties.

Frequency selective surfaces

A switchable Frequency Selective Surface (FSS) in which the switchable elements are Plasma-shells. Plasma-shells as described herein allow for control or reconfiguration of the FSS electromagnetic (EM) properties.

Vacuum exhaust method

A vacuum exhaust method is for decreasing a pressure in a processing chamber in which a mounting table configured to mount thereon a substrate is provided by using a gas exhaust unit. The vacuum exhaust method includes mounting a non-evaporated getter (NEG) on the mounting table, and adsorbing an active gas in the processing chamber on the NEG mounted on the mounting table. In the adsorbing the active gas, the NEG is maintained at a predetermined temperature.

Frequency Selective Surfaces

A switchable Frequency Selective Surface (FSS) in which the switchable elements are Plasma-shells. Plasma-shells as described herein allow for control or reconfiguration of the FSS electromagnetic (EM) properties.

Frequency Selective Surfaces

A switchable Frequency Selective Surface (FSS) in which the switchable elements are Plasma-shells. Plasma-shells as described herein allow for control or reconfiguration of the FSS electromagnetic (EM) properties.

Frequency selective surfaces

A switchable Frequency Selective Surface (FSS) in which the switchable elements are Plasma-shells. Plasma-shells as described herein allow for control or reconfiguration of the FSS electromagnetic (EM) properties.

Frequency selective surfaces

A switchable Frequency Selective Surface (FSS) in which the switchable elements are Plasma-shells. Plasma-shells as described herein allow for control or reconfiguration of the FSS electromagnetic (EM) properties.