A particle beam system includes: a particle source to generate a beam of charged particles; a first multi-lens array including a first multiplicity of individually adjustable and focusing particle lenses so that at least some of the particles pass through openings in the multi-lens array in the form of a plurality of individual particle beams; a second multi-aperture plate including a multiplicity of second openings downstream of the first multi-lens array so that some of the particles which pass the first multi-lens array impinge on the second multi-aperture plate and some of the particles which pass the first multi-lens array pass through the openings in the second multi-aperture plate; and a controller configured to supply an individually adjustable voltage to the particle lenses of the first multi-lens array and thus individually adjust the focusing of the associated particle lens for each individual particle beam.

A manipulator for manipulating a charged particle beam in a projection system, the manipulator comprising a substrate having opposing major surfaces in each of which is defined an aperture and a through-passage having an interconnecting surface extending between the apertures; wherein the interconnecting surface comprises one or more electrodes; the manipulator further comprising a potential divider comprising two or more resistive elements connected in series, the potential divider comprising an intermediate node between each pair of adjacent resistive elements, wherein at least one resistive element is formed within the substrate so as to extend between the opposing major surfaces; wherein the intermediate node is electrically connected to at least one of the one or more electrodes.

A multipole lens includes a hollow cylindrical non-magnetic bobbin provided with a plurality of slits, and a metal wire. The plurality of slits are disposed such that a central angle between adjacent slits is (360/12N), N being a natural number. Winding numbers of the metal wire in the plurality of slits are equal. When a cross section of the non-magnetic bobbin orthogonal to a longitudinal direction of the slits is divided into an even number of regions having an equal central angle and including two or more of the slits, directions in which the metal wire passes through the slits provided in the region are same, and a direction in which the metal wire passes through the slits provided in the adjacent region is reversed.

The present disclosure relates to an apparatus and method that manipulate the voltage at an edge ring relative to a substrate located on a substrate support assembly. The substrate support assembly has a body having a substrate support portion having a substrate electrode embedded therein for applying a substrate voltage to a substrate. The body of the substrate support assembly further has an edge ring portion disposed adjacent to the substrate support portion. The edge ring portion has an edge ring electrode embedded therein for applying an edge ring voltage to an edge ring. An edge ring voltage control circuit is coupled to the edge ring electrode. A substrate voltage control circuit is coupled to the substrate electrode. The edge ring voltage control circuit and the substrate voltage control circuit are independently tunable to generate a difference in voltage between the edge ring voltage and the substrate voltage.

The present disclosure relates to an apparatus and method that manipulates the voltage at an edge ring relative to a substrate located on a substrate support located within a processing chamber. The apparatus includes a substrate support assembly that has a body having a substrate electrode embedded therein for applying a voltage to a substrate. The body of the substrate support assembly additionally has an edge ring electrode embedded therein for applying a voltage to an edge ring. The apparatus further includes an edge ring voltage control circuit coupled to the edge ring electrode. A substrate voltage control circuit is coupled to the substrate electrode. The edge ring voltage control circuit and the substrate voltage control circuit are independently tunable to generate a difference in voltage between the edge ring voltage and the substrate voltage.

A multi-beam charged particle system includes: a vacuum enclosure having an opening covered by a door; a particle source configured to generate charged particles, wherein the particle source is arranged within the vacuum enclosure; at least one multi-aperture plate module including at least one multi-aperture plate and a base; and a transfer box having an opening covered by a door. The at least one multi-aperture plate includes a plurality of apertures. The base is configured to hold the at least one multi-aperture plate. The base is configured to be fixed relative to the vacuum enclosure such that the multi-aperture plate module is arranged in an interior of the vacuum enclosure such that, during operation of the particle beam system, particles traverse the plural multi-aperture plates through the apertures of the plates.

A scanning electron microscope. The scanning electron microscope may include a sliding vacuum seal between the electron optical imaging system and the sample carrier with a first plate having a first aperture associated with the electron optical imaging system and resting against a second plate having a second aperture associated with the sample carrier. The first plate and/or the second plate includes a groove circumscribing the first and/or second aperture. The scanning electron microscope may include a detector movable relative to the electron beam. The scanning electron microscope may include a motion control unit for moving a sample carrier along a collision free path.

A particle beam system includes: a particle source to generate a beam of charged particles; a first multi-lens array including a first multiplicity of individually adjustable and focusing particle lenses so that at least some of the particles pass through openings in the multi-lens array in the form of a plurality of individual particle beams; a second multi-aperture plate including a multiplicity of second openings downstream of the first multi-lens array so that some of the particles which pass the first multi-lens array impinge on the second multi-aperture plate and some of the particles which pass the first multi-lens array pass through the openings in the second multi-aperture plate; and a controller configured to supply an individually adjustable voltage to the particle lenses of the first multi-lens array and thus individually adjust the focusing of the associated particle lens for each individual particle beam.

A method and system for providing at least one of planarization, densification, and exfoliation of a porous material using ion beams. The method may use an ion beam generator to generate an ion beam, the ion beam having energy above 0.1 MeV. The ion beam generator may irradiate the surface of a porous material with the ion beam to produce at least one of planarization, densification, and exfoliation of the porous material.

Provided herein are approaches for reducing particles in an ion implanter. In some embodiments, an electrostatic filter of the ion implanter may include a housing and a plurality of conductive beam optics within the housing, the plurality of conductive beam optics arranged around an ion beam-line. At least one conductive beam optic of the plurality of conductive beam optics may include a conductive core element, a resistive material disposed around the conductive core, and a conductive layer disposed around the resistive material.