Patent classifications
H01J2237/1532
APERTURE ASSEMBLY, BEAM MANIPULATOR UNIT, METHOD OF MANIPULATING CHARGED PARTICLE BEAMS, AND CHARGED PARTICLE PROJECTION APPARATUS
The disclosure relates to apparatus and methods for manipulating charged particle beams. In one arrangement, an aperture assembly is provided that comprises a first aperture body and a second aperture body. Apertures in the first aperture body are aligned with apertures in the second aperture body. The alignment allows charged particle beams to pass through the aperture assembly. The first aperture body comprises a first electrode system for applying an electrical potential to an aperture perimeter surface of each aperture in the first aperture body. The first electrode system comprises a plurality of electrodes. Each electrode is electrically isolated from each other electrode and electrically connected simultaneously to the aperture perimeter surfaces of a different one of a plurality of groups of the apertures in the first aperture body.
Particle beam system for adjusting the current of individual particle beams
A particle beam system includes: a particle source to generate a beam of charged particles; a first multi-lens array including a first multiplicity of individually adjustable and focusing particle lenses so that at least some of the particles pass through openings in the multi-lens array in the form of a plurality of individual particle beams; a second multi-aperture plate including a multiplicity of second openings downstream of the first multi-lens array so that some of the particles which pass the first multi-lens array impinge on the second multi-aperture plate and some of the particles which pass the first multi-lens array pass through the openings in the second multi-aperture plate; and a controller configured to supply an individually adjustable voltage to the particle lenses of the first multi-lens array and thus individually adjust the focusing of the associated particle lens for each individual particle beam.
ELECTROSTATIC MIRROR CHROMATIC ABERRATION CORRECTORS
Electrostatic mirror chromatic aberration (Cc) correctors, according to the present disclosure, comprise an electrostatic electron mirror that itself comprises a multipole. The electrostatic electron mirror is positioned within the corrector such that, when the corrector is in use, an electron beam passing through the corrector is not incident on the electrostatic electron mirror along the optical axis of the mirror. The mirror object distance of the electrostatic mirror is equal to the mirror image distance of the electrostatic mirror, and the electrostatic mirror is configured such that the electrostatic mirror applies no dispersion or coma aberration to the electron beam. The multipole is positioned in the mirror plane of the electrostatic electron mirror, and in some embodiments the multipole is a quadrupole.
PARTICLE BEAM SYSTEM HAVING A MULTI-POLE LENS SEQUENCE FOR INDEPENDENTLY FOCUSSING A MULTIPLICITY OF INDIVIDUAL PARTICLE BEAMS, AND ITS USE AND ASSOCIATED METHOD
A particle beam system includes a multiple beam particle source to generate a multiplicity of charged individual particle beams, and a multi-pole lens sequence with first and second multi-pole lens arrays. The particle beam system also includes a controller to control the multi-pole lenses of the multi-pole lens sequence so related groups of multi-pole lenses of the multi-pole lens sequence through which the same individual particle beam passes in each case altogether exert an individually adjustable and focussing effect on the respective individual particle beam passing therethrough.
Charged Particle Beam Device and Aberration Correction Method
A charged particle optical system includes an aberration corrector 209 that corrects aberration of a charged particle beam and has multipoles of a plurality of stages. The aberration corrector generates a plurality of multipole fields in a superimposed manner for each of the multipoles of the plurality of stages in order to correct the aberration of the charged particle beam. In order to reduce the influence of a parasitic field due to distortion of the multipole, for a first multipole field to be generated in a multipole of any stage among the plurality of stages, a value of a predetermined correction voltage or correction current to be applied to a plurality of poles for generating the first multipole field is corrected so as to eliminate movement of an observation image obtained based on electrons detected from a detector 215 by irradiating a sample with the charged particle beam before and after the first multipole field is generated.
Multi-beam inspection apparatus
An improved source conversion unit of a charged particle beam apparatus is disclosed. The source conversion unit comprises a first micro-structure array including a plurality of micro-structures. The plurality of micro-structures is grouped into one or more groups. Corresponding electrodes of micro-structures in one group are electrically connected and driven by a driver to influence a corresponding group of beamlets. The micro-structures in one group may be single-pole structures or multi-pole structures. The micro-structures in one group have same or substantially same radial shifts from an optical axis of the apparatus. The micro-structures in one group have same or substantially same orientation angles with respect to their radial shift directions.
Particle beam profiles for analytic equipment configuration
Beam intercept profiles are measured as a particle beam transversely scans across a probe. A current of beam particles, a detector intensity, or image pixel intensities can variously be measured to obtain the profiles. Multiple profiles are used to determine geometric parameters which in turn can be used to configure equipment. In one application, transverse beam intercept profiles are measured for different waist heights of the particle beam. Steepness of the several profiles can be used to determine a height of the probe as the height at which the profile is steepest. The known probe height enables placing the probe in contact with a substrate at another known height. In another application, transverse beam intercept profiles of orthogonal probe edges are used to position a beam waist, reduce spot size, or reduce astigmatism. Techniques are applicable to SEM, FIB, and nanoprobe systems. Methods and apparatus are disclosed, with variations.
CHARGED PARTICLE ASSESSMENT TOOL, INSPECTION METHOD
A charged particle assessment tool including: an objective lens configured to project a plurality of charged particle beams onto a sample, the objective lens having a sample-facing surface defining a plurality of beam apertures through which respective ones of the charged particle beams are emitted toward the sample; and a plurality of capture electrodes, each capture electrode adjacent a respective one of the beam apertures, configured to capture charged particles emitted from the sample.
ELECTRON OPTICAL MODULE FOR PROVIDING AN OFF-AXIAL ELECTRON BEAM WITH A TUNABLE COMA
An electron optical module for providing an off-axial electron beam with a tunable coma, according to the present disclosure includes a structure positioned downstream of an electron source and an electron lens assembly positioned between the structure and the electron source. The structure generates a decelerating electric field, and is positioned to prevent the passage of electrons along the optical axis of the electron lens assembly. The electron optical module further includes a micro-lens that is not positioned on the optical axis of the electron lens assembly and is configured to apply a lensing effect to an off-axial election beam. Aberrations applied to the off-axial electron beam by the micro-lens and the electron lens assembly combine so that a coma of the off-axial beam has a desired value in a downstream plane.
CHARGED PARTICLE BEAM SYSTEM
A charged particle beam system includes: a charged particle beam device configured to emit a charged particle beam from a charged particle source to a sample via a charged particle optical system; and a control system configured to control the charged particle beam device. The control system scans the sample with the charged particle beam in a manner of forming a scan trajectory and determines scores of signal intensities associated with different scan directions in the scan trajectory. The control system generates, based on a relation between the scores and the different scan directions, information on at least one of a focus deviation and an aberration coefficient of the charged particle optical system.