The disclosure relates to a low energy electron microscopy. The electron microscopy includes a vacuum chamber; an electron gun used to emit electron beam; a diffraction chamber; an imaging device; a sample holder used to fix two-dimensional nanomaterial sample; a vacuum pumping device; and a control computer. The electron beam transmits the sample to form a transmission electron beam and diffraction electron beam. The control computer includes a switching module to switch the work mode between a large beam spot diffraction imaging mode and small beam spot diffraction imaging mode.

The invention relates to a method of manufacturing a charged particle detector, comprising the steps of providing a sensor device, such as an Active Pixel Sensor (APS). Said sensor device at least comprises a substrate layer and a sensitive layer. The method further comprises the step of providing a mechanical supporting layer and connecting said mechanical supporting layer to said sensor device. After connection, the sensitive layer is situated in between said substrate layer and said mechanical supporting layer. By connecting the mechanical supporting layer, it is possible to thin said substrate layer for forming said charged particle detector. The mechanical supporting layer forms part of the manufactured detector. The detector can be used in a charged particle microscope, such as a Transmission Electron Microscope for direct electron detection.

The present invention discloses an imaging device, an imaging method, and an imaging system, belonging to the field of sample image data acquisition and imaging technology. The imaging device includes: a charged particle source, a convergence system, a scanning control system, a detection module, and a spectral analysis module disposed below the detection module, where the detection module includes a plurality of pixelated detector units; and the detection module is provided with a hole thereon. The diffraction pattern is obtained by using the detection module, and the spectral analysis module performs spectral analysis on a charged particle beam passing through the hole, so as to obtain the diffraction pattern and spectral signal simultaneously by one scanning. The imaging method of the present invention is based on a hollow ptychography method, which enables toper form imaging on the diffraction pattern obtained through the detection module, with good imaging effects.

The invention relates to a method of manufacturing a charged particle detector, comprising the steps of providing a sensor device, such as an Active Pixel Sensor (APS). Said sensor device at least comprises a substrate layer and a sensitive layer. The method further comprises the step of providing a mechanical supporting layer and connecting said mechanical supporting layer to said sensor device. After connection, the sensitive layer is situated in between said substrate layer and said mechanical supporting layer. By connecting the mechanical supporting layer, it is possible to thin said substrate layer for forming said charged particle detector. The mechanical supporting layer forms part of the manufactured detector. The detector can be used in a charged particle microscope, such as a Transmission Electron Microscope for direct electron detection.

The present invention discloses an imaging device, an imaging method, and an imaging system, belonging to the field of sample image data acquisition and imaging technology. The imaging device includes: a charged particle source, a convergence system, a scanning control system, a detection module, and a spectral analysis module disposed below the detection module, where the detection module includes a plurality of pixelated detector units; and the detection module is provided with a hole thereon. The diffraction pattern is obtained by using the detection module, and the spectral analysis module performs spectral analysis on a charged particle beam passing through the hole, so as to obtain the diffraction pattern and spectral signal simultaneously by one scanning. The imaging method of the present invention is based on a hollow ptychography method, which enables toper form imaging on the diffraction pattern obtained through the detection module, with good imaging effects.

An imaging sensor assembly includes at least one substrate including a plurality of substrate signal lines. The imaging sensor assembly also includes at least one imaging sensor package disposed on the at least one substrate, the at least one imaging sensor package including at least one imaging sensor disposed on at least one imaging sensor package substrate. The imaging sensor assembly also includes at least one receiver package disposed on the at least one substrate, the receiver package including at least one receiver integrated circuit disposed on at least one receiver package substrate. The imaging sensor assembly also includes at least one electrical interconnect operably coupled to the at least one imaging sensor package and the at least one receiver package. A plurality of data signals are transmitted between the at least one imaging sensor package and the at least one receiver package via the at least one electrical interconnect.

The disclosure relates to a low energy electron microscopy. The electron microscopy includes a vacuum chamber; an electron gun used to emit electron beam; a diffraction chamber; an imaging device; a sample holder used to fix two-dimensional nanomaterial sample; a vacuum pumping device; and a control computer. The electron beam transmits the sample to form a transmission electron beam and diffraction electron beam. The control computer includes a switching module to switch the work mode between a large beam spot diffraction imaging mode and small beam spot diffraction imaging mode.

An imaging sensor assembly includes at least one substrate including a plurality of substrate signal lines. The imaging sensor assembly also includes at least one imaging sensor package disposed on the at least one substrate, the at least one imaging sensor package including at least one imaging sensor disposed on at least one imaging sensor package substrate. The imaging sensor assembly also includes at least one receiver package disposed on the at least one substrate, the receiver package including at least one receiver integrated circuit disposed on at least one receiver package substrate. The imaging sensor assembly also includes at least one electrical interconnect operably coupled to the at least one imaging sensor package and the at least one receiver package. A plurality of data signals are transmitted between the at least one imaging sensor package and the at least one receiver package via the at least one electrical interconnect.

A multi-beam particle microscope includes first particle optics in order to direct particle beams onto an object, a detector with detection regions, with a transducer being assigned to each detection region, and a data acquisition system, which has a control computer system, image recording computer systems and a screen. The image recording computer systems receive electrical signals from the transducers and generates a first file, which represents a high resolution image, and a second file, which represents a low resolution image. The control computer system maintains a data structure which represents an assignment of transducers to two-dimensional spatial vectors and depicts the images on the screen, wherein a reference point in each image is arranged on the screen in a coordinate system of the screen at a location which is defined by a sum of a leading vector, which is the same for all images, and the spatial vector.