Patent classifications
H01J2237/28
Pattern Matching Device and Computer Program for Pattern Matching
The purpose of the present invention is to provide a pattern matching device and computer program that carry out highly accurate positioning even if edge positions and numbers change. The present invention proposes a computer program and a pattern matching device wherein a plurality of edges included in first pattern data to be matched and a plurality of edges included in second pattern data to be matched with the first pattern data are associated, a plurality of different association combinations are prepared, the plurality of association combinations are evaluated using index values for the plurality of edges, and matching processing is carried out using the association combinations selected through the evaluation.
ELECTRON SOURCE BASED ON FIELD EMISSION AND PRODUCTION PROCESS FOR SAME
The invention relates to an electron source comprising a conductive substrate, a conductor disposed facing the substrate, the electron source emitting an electron beam when the conductor is positively biased with respect to the substrate, and an electrically insulating crystal arranged on the substrate, facing the conductor, the substrate defining with the crystal a void including at least one peak located at a distance from the crystal, the crystal having, in a plane parallel to the substrate, dimensions of less than 100 nm and a thickness of less than 50 nm.
SCANNING ELECTRON MICROSCOPE DEVICE AND ELECTRON BEAM INSPECTION APPARATUS
A scanning electron microscope device for a sample to be detected and an electron beam inspection apparatus are provided, the scanning electron microscope device being configured to project electron beam to a surface of the sample to generate backscattered electrons and secondary electrons, and comprising: an electron beam source, a deflection mechanism, and an objective lens assembly. The deflection mechanism comprises a first deflector located downstream the electron beam source and a second deflector located downstream the first deflector. The objective lens assembly comprises: an excitation coil; and a magnetic yoke, formed by a magnetizer material as a housing which opens towards the sample and comprising a hollow body defining an internal chamber where the excitation coil is accommodated, and at least one inclined portion extending inward from the hollow body at an angle with reference to the hollow body and directing towards the optical axis, with an end of the at least one inclined portion being formed into a pole piece. The deflection mechanism further comprises a third deflector located between the second deflector and the objective lens assembly and disposed in an opening delimited and circumscribed by the pole piece, and each of the first deflector, the second deflector and the third deflector is an electrostatic deflector.
Support system for specified inspection, support method for specified inspection, and non-transitory computer readable medium
The purpose of the present invention is to increase accuracy of a specific test using an electronic microscope and improve work efficiency. Provided is a system that identifies test recipe information corresponding to an object to be tested on the basis of attribute information about a testing sample, and analyzes and evaluates the object to be tested contained in the testing sample by checking image data and element analysis data that are acquired by a measuring device in accordance with a control program for the test recipe information, against reference image data and reference element analysis data that are used as evaluation references for the object to be tested.
Charged particle beam device
Provided is a charged particle beam device capable of improving the accuracy of measurement and processing. The charged particle beam device includes an electrostatic chuck that adsorbs an inspection object, a voltage generation unit that generates a voltage to be supplied to the electrostatic chuck, and a state determination unit that determines a state of the inspection object. Here, the state determination unit includes a current waveform simulation unit that simulates a time-series change of an electrostatic chuck current flowing through the voltage generation unit when the electrostatic chuck normally adsorbs the inspection object, a difference integration unit that acquires an integration value of a difference between a time-series change of a simulation current generated by the current waveform simulation unit and the time-series change of the electrostatic chuck current flowing through the voltage generation unit, and a difference determination unit that determines an adsorption state of the inspection object and a shape feature of the inspection object based on the integration value of the difference.
Charged Particle Beam Device and Aberration Correction Method
A charged particle optical system includes an aberration corrector 209 that corrects aberration of a charged particle beam and has multipoles of a plurality of stages. The aberration corrector generates a plurality of multipole fields in a superimposed manner for each of the multipoles of the plurality of stages in order to correct the aberration of the charged particle beam. In order to reduce the influence of a parasitic field due to distortion of the multipole, for a first multipole field to be generated in a multipole of any stage among the plurality of stages, a value of a predetermined correction voltage or correction current to be applied to a plurality of poles for generating the first multipole field is corrected so as to eliminate movement of an observation image obtained based on electrons detected from a detector 215 by irradiating a sample with the charged particle beam before and after the first multipole field is generated.
CHARGED-PARTICLE DETECTOR PACKAGE FOR HIGH SPEED APPLICATIONS
A charged particle beam system may include a detector. A package for a detector may have a package body that includes two sets of pins, each of the sets of pins including two pins. Each pin of the sets of pins may be configured to be connected to one of two terminals of a sensing element. Pins of different sets may be configured to be connected to a different one of the two terminals of the diode. The sets of pins may be arranged with a symmetry such that magnetic fields generated when current passes through the sets of pins is reduced due to the symmetry.
CERTAIN IMPROVEMENTS OF MULTI-BEAM GENERATING AND MULTI-BEAM DEFLECTING UNITS
Certain improvements of multi-beam raster units such as multi-beam generating units and multi-beam deflector units of a multi-beam charged particle microscopes are provided. The improvements include design, fabrication and adjustment of multi-beam raster units including apertures of specific shape and dimensions. The improvements can enable multi-beam generation and multi-beam deflection or stigmation with higher precision. The improvements can be relevant for routine applications of multi-beam charged particle microscopes, for example in semiconductor inspection and review, where high reliability and high reproducibility and low machine-to-machine deviations are desirable.
LIGHT-EMITTING BODY, ELECTRON BEAM DETECTOR, AND SCANNING ELECTRON MICROSCOPE
A light emitter is a light emitter for converting incident electrons into light, and includes a multiple quantum well structure for generating the light by incidence of the electrons, and an electron incident surface provided on the multiple quantum well structure. A certain barrier layer included in a plurality of barrier layers constituting the multiple quantum well structure is thicker than another barrier layer included in the plurality of barrier layers and located on the electron incident surface side with respect to the certain barrier layer.
METHOD FOR OPERATING A PARTICLE BEAM DEVICE, COMPUTER PROGRAM PRODUCT AND PARTICLE BEAM DEVICE FOR CARRYING OUT THE METHOD
A particle beam apparatus is used for imaging, processing and/or analyzing an object. A computer program product may be used to facilitate imaging, processing and/or analyzing the object. A magnification may be chosen from a first magnification range of the particle beam apparatus by driving a first amplifier unit and a second amplifier unit. If it is established that there are prerequisites which would actually result in the particle beam apparatus being switched to a different magnification from a second magnification range, the switching is avoided by feeding an analog amplifier signal from an amplifier unit to a scanning unit of the particle beam apparatus, guiding the particle beam over the object using the scanning unit, and imaging, processing and/or analyzing the object with the particle beam.