The present disclosure provides a charged particle beam device capable of simultaneously achieving protection of a charged particle source against electrical discharging inside a charged particle gun and highly accurate control of the charged particle gun, for both DC and AC components. A charged particle gun according to the present disclosure is configured such that an extraction voltage and an acceleration voltage are superposed and supplied to a charged particle beam source, a wiring between the charged particle beam source and a voltage circuit is covered with first and second enclosures, the first enclosure is configured to be connected to an extraction electrode, and the second enclosure is configured to be connected to an acceleration electrode and to a reference voltage of the voltage circuit.

A method is provided for forming a three-dimensional article through successively depositing individual layers of powder material that are fused together so as to form the article, the method comprising the steps of: providing at least one electron beam source emitting an electron beam for at least one of heating or fusing the powder material, where the electron beam source comprises a cathode, an anode, and a Wehnelt cup between the cathode and anode; providing a guard ring between the Wehnelt cup and the anode and in close proximity to the Wehnelt cup, where the guard ring is having an aperture which is larger than an aperture of the Wehnelt cup; protecting the cathode and/or the Wehnelt cup against vacuum arc discharge energy currents when forming the three-dimensional article by providing the guard ring with a higher negative potential than the Wehnelt cup and cathode.

A filament assembly includes a core and a filament. At least a central portion of the filament is disposed on the core. At least the central portion may be straight or may have a high-resistance configuration such as one in which the filament follows a path that changes direction. A thermionically emissive layer may be disposed on the core so as to encapsulate at least the central portion. The filament assembly may be utilized in any application requiring the production of electrons.

Provided are an on-chip micro electron source and manufacturing method thereof. The on-chip micro electron source is provided with a heat conductive layer (10), and at least one electrode (122) in the same pair of electrodes is connected with the heat conductive layer (10) via a through hole (111) of an insulating layer, such that the heat generated by the on-chip micro electron source can be dissipated through the electrode (122) and the heat conductive layer (10), thereby significantly improving the heat dissipation ability of the on-chip electron source. Therefore, the on-chip micro electron source is capable of integrating multiple single electron sources on the same substrate to form an electron source integration array with a high integration level, enabling the on-chip electron source to have high overall emission current, further meeting more application requirements. The on-chip micro electron source can be widely applied to various electronic devices involving electron sources, for example, X-ray tubes, microwave tubes, flat-panel displays and the like.

Provided are an on-chip miniature electron source and a method for manufacturing the same. The on-chip miniature electron source includes: a thermal conductive layer; an insulating layer provided on the thermal conductive layer, where the insulating layer is made of a resistive-switching material, and at least one through hole is provided in the insulating layer; and at least one electrode pair provided on the insulating layer, where at least one electrode of the electrode pair is in contact with and connected to the thermal conductive layer via the through hole, where there is a gap between two electrodes of the electrode pair, and a tunnel junction is formed within a region of the insulating layer under the gap. Thus, heat generated by the on-chip micro electron source can be dissipated through the electrode and the thermal conductive layer, thereby significantly improving heat dissipation ability of the on-chip miniature electron source.

An x-ray tube includes an electron emitter and a cathode cup having a recess that holds the electron emitter. The recess has a bottom surface, and a shield is positioned in the recess between the electron emitter and the bottom surface. The shield is configured to receive deposited sublimated emitter material and to maintain the sublimated emitter material away from the electron emitter.

An x-ray tube includes an electron emitter and a cathode cup having a recess that holds the electron emitter. The recess has a bottom surface, and a shield is positioned in the recess between the electron emitter and the bottom surface. The shield is configured to receive deposited sublimated emitter material and to maintain the sublimated emitter material away from the electron emitter.

To suppress both influence of electron emission from a cathode side surface and consumption of energy to be supplied to a heater, while being provided with a grid, an electron gun of the present invention includes: a cathode capable of emitting electrons by heating; a grid capable of controlling the electron emission; and a cathode shield which is an conductor including a material portion located in the vicinity of a side surface of the cathode and facing at least a portion of the side surface via a gap or a heat insulating material, and not being made in direct physical coupling nor in direct physical contact with the cathode.

A field emission cathode device and method for forming a field emission cathode device involve a cathode element having a field emission surface disposed in spaced-apart relation to a gate electrode element so as to define a gap between the field emission surface and the gate electrode element. The gate electrode element extends laterally between opposing anchored ends. The gate electrode element is arranged to deform away from the field emission surface in response to heat, so as to increase the gap between the field emission surface and the gate electrode element.

To suppress both influence of electron emission from a cathode side surface and consumption of energy to be supplied to a heater, while being provided with a grid, an electron gun of the present invention includes: a cathode capable of emitting electrons by heating; a grid capable of controlling the electron emission; and a cathode shield which is an conductor including a material portion located in the vicinity of a side surface of the cathode and facing at least a portion of the side surface via a gap or a heat insulating material, and not being made in direct physical coupling nor in direct physical contact with the cathode.