A method of manufacturing a flat panel display is disclosed. In one aspect, the method includes forming a plurality of display elements over a first substrate and forming over the first substrate or a second substrate a plurality of sealing units respectively surrounding the display elements. The method further c includes arranging the first and second substrates to face each other and emitting a laser beam to the sealing units so as to bond the first and second substrates. The emitting includes (a) emitting a first laser beam, from a first laser source, clockwise or counterclockwise along perimeters of the sealing units and (b) substantially simultaneously emitting a second laser beam, from a second laser source, to facing sides of adjacent ones of the sealing units.

The application provides a sintering apparatus, a packaging system for an organic light emitting diode device and a sintering method, belongs to the technical field of organic light emitting diode device and can solve problems of long process time and high cost existed in the existing high temperature sintering process of organic light emitting diode device. The sintering apparatus comprises two sintering chambers capable of being communicated with each other, during operation, the substrate coated with glass cement is first placed into a sealed first sintering chamber to complete a first sintering process; then the substrate is placed into the second sintering chamber to complete a second sintering process. Thus, a time interval between the first sintering process and the second sintering process can be reduced, and no more nitrogen is wasted in transition from the first sintering process to the second sintering process.

The invention relates to a method of producing a plate arrangement comprising two plates (1, 2) which, at least in sections, have an intermediate space (4) located between them and a constant distance (d) to one another and/or are arranged parallel to one another and between which a fusible solder material (3, 3′) is arranged. The task of setting a defined distance between the plates as accurately as possible is solved according to the invention by creating a pressure difference between the intermediate space (4) between the plates and the outer space surrounding the plates in such a way that the pressure in the outer space is higher than in the intermediate space (4) and that the temperature of the solder material (3, 3′) is at least temporarily raised above its melting temperature during the existence of the pressure difference.

A heatable element is configured to apply sufficient energy density to contaminants in an internal ambient atmosphere with in a sealable housing to drive a reaction that inactivates the contaminants.

The present disclosure provides a flexible backlight, a method for manufacturing the same, and a display device. The flexible backlight includes: a first flexible substrate and a second flexible substrate arranged opposite to each other; a plurality of spacers arranged between the first flexible substrate and the second flexible substrate, for supporting a spacing between the first flexible substrate and the second flexible substrate, and for forming an accommodating chamber between the first flexible substrate and the second flexible substrate; a first electrode and a second electrode for forming an electric field; a gas contained in the accommodating chamber, in which the gas is capable of emitting a non-visible light by the action of the electric field; and a photoexcitation layer arranged on the second flexible substrate, in which the photoexcitation layer can emit a visible light under illumination of the non-visible light and is in contact with the spacer.

The present disclosure provides a flexible backlight, a method for manufacturing the same, and a display device. The flexible backlight includes: a first flexible substrate and a second flexible substrate arranged opposite to each other; a plurality of spacers arranged between the first flexible substrate and the second flexible substrate, for supporting a spacing between the first flexible substrate and the second flexible substrate, and for forming an accommodating chamber between the first flexible substrate and the second flexible substrate; a first electrode and a second electrode for forming an electric field; a gas contained in the accommodating chamber, in which the gas is capable of emitting a non-visible light by the action of the electric field; and a photoexcitation layer arranged on the second flexible substrate, in which the photoexcitation layer can emit a visible light under illumination of the non-visible light and is in contact with the spacer.

The application provides a sintering apparatus, a packaging system for an organic light emitting diode device and a sintering method, belongs to the technical field of organic light emitting diode device and can solve problems of long process time and high cost existed in the existing high temperature sintering process of organic light emitting diode device. The sintering apparatus comprises two sintering chambers capable of being communicated with each other, during operation, the substrate coated with glass cement is first placed into a sealed first sintering chamber to complete a first sintering process; then the substrate is placed into the second sintering chamber to complete a second sintering process. Thus, a time interval between the first sintering process and the second sintering process can be reduced, and no more nitrogen is wasted in transition from the first sintering process to the second sintering process.

A heatable element is configured to apply sufficient energy density to contaminants in an internal ambient atmosphere with in a sealable housing to drive a reaction that inactivates the contaminants.

A glass layer 103 containing a binder, a laser-light-absorbing pigment, and a glass fit 102 is irradiated with laser light L2, so as to gasify the binder and melt the glass fit 102, thereby fixing the glass layer 103 to a glass member 104. This allows the glass layer 103 fixed to the glass member 104 to let out the binder and enhance the laser light absorptance, so as to yield a uniform state. As a result, fusing glass members 104, 105 to each other with the glass layer 103 having such a stable state interposed therebetween allows the glass members 104, 105 to have a uniform fusing state therebetween.

At the time of temporary firing for fixing a glass layer 3 to a glass member 4, the glass layer 3 is irradiated with laser light L2 having a ring-shaped irradiation region. At this time, in a width direction of the glass layer 3, two peaks M in a beam profile of the laser light L2 respectively overlap both edge parts 3b of the glass layer 3. This allows a center part 3a and each of both edge parts 3b of the glass layer 3 to be irradiated for shorter and longer times with a part having a relatively high intensity in the laser light L2, respectively. As a consequence, the amount of heat input by irradiation with the laser light L2 is homogenized between the center part 3a and both edge parts 3b in the glass layer 3, whereby the whole glass layer 3 is molten appropriately.