Patent classifications
H01K1/04
FILAMENT ASSEMBLY FOR GENERATING ELECTRONS, AND RELATED DEVICES, SYSTEMS AND METHODS
A filament assembly includes a core and a filament. At least a central portion of the filament is disposed on the core. At least the central portion may be straight or may have a high-resistance configuration such as one in which the filament follows a path that changes direction. A thermionically emissive layer may be disposed on the core so as to encapsulate at least the central portion. The filament assembly may be utilized in any application requiring the production of electrons.
FILAMENT ASSEMBLY FOR GENERATING ELECTRONS, AND RELATED DEVICES, SYSTEMS AND METHODS
A filament assembly includes a core and a filament. At least a central portion of the filament is disposed on the core. At least the central portion may be straight or may have a high-resistance configuration such as one in which the filament follows a path that changes direction. A thermionically emissive layer may be disposed on the core so as to encapsulate at least the central portion. The filament assembly may be utilized in any application requiring the production of electrons.
INFRARED SOURCE FOR AIRPORT RUNWAY LIGHT APPLICATIONS
An airport runway light for use as a runway approach light for a runway lighting system, the runway light having a light body with a base configured to support the runway light in a light socket of a runway lighting system, the base having an electrical connection to electrically connect the runway light to the runway lighting system, the light further including one or more output windows wherein the runway light has a high-efficiency infrared source and one or more infrared reflectors to direct the infrared source outwardly through the one or more output windows, the infrared source including a silicon nitride element wherein the infrared source produces virtually no detectable visible light and with much less power consumption.
INFRARED SOURCE FOR AIRPORT RUNWAY LIGHT APPLICATIONS
An airport runway light for use as a runway approach light for a runway lighting system, the runway light having a light body with a base configured to support the runway light in a light socket of a runway lighting system, the base having an electrical connection to electrically connect the runway light to the runway lighting system, the light further including one or more output windows wherein the runway light has a high-efficiency infrared source and one or more infrared reflectors to direct the infrared source outwardly through the one or more output windows, the infrared source including a silicon nitride element wherein the infrared source produces virtually no detectable visible light and with much less power consumption.
Infrared source for airport runway light applications
An airport runway light for use as a runway approach light for a runway lighting system, the runway light having a light body with a base configured to support the runway light in a light socket of a runway lighting system, the base having an electrical connection to electrically connect the runway light to the runway lighting system, the light further including one or more output windows wherein the runway light has a high-efficiency infrared source and one or more infrared reflectors to direct the infrared source outwardly through the one or more output windows, the infrared source including a silicon nitride element wherein the infrared source produces virtually no detectable visible light and with much less power consumption.
Infrared source for airport runway light applications
An airport runway light for use as a runway approach light for a runway lighting system, the runway light having a light body with a base configured to support the runway light in a light socket of a runway lighting system, the base having an electrical connection to electrically connect the runway light to the runway lighting system, the light further including one or more output windows wherein the runway light has a high-efficiency infrared source and one or more infrared reflectors to direct the infrared source outwardly through the one or more output windows, the infrared source including a silicon nitride element wherein the infrared source produces virtually no detectable visible light and with much less power consumption.
Flashtube with submicron fuel particles and fusable nucleotide light-absorbing particles
A device and a method of heating nano- to micro-scale light absorbent particles within a flashtube designed to sequentially emit intense light, followed by an intense pressure wave. The flashtube device includes a housing and a central filament surrounded by the housing. An inner surface of the housing can be coated with light-scattering particles and/or light-absorbing particles. The filament is generally held in a superconducting state.
Flashtube with submicron fuel particles and fusable nucleotide light-absorbing particles
A device and a method of heating nano- to micro-scale light absorbent particles within a flashtube designed to sequentially emit intense light, followed by an intense pressure wave. The flashtube device includes a housing and a central filament surrounded by the housing. An inner surface of the housing can be coated with light-scattering particles and/or light-absorbing particles. The filament is generally held in a superconducting state.
METHOD FOR SINTERING CERAMIC MATERIALS
A method for producing a densified component and an article comprising a densified component is disclosed. In a method for producing a densified component, a starting material is subjected to an electric field at a temperature (T) below 800° C. The starting material comprises a first material from the group consisting of cuprates. The method has a low technical effort, since densification is possible without heating the starting material.
METHOD FOR SINTERING CERAMIC MATERIALS
A method for producing a densified component and an article comprising a densified component is disclosed. In a method for producing a densified component, a starting material is subjected to an electric field at a temperature (T) below 800° C. The starting material comprises a first material from the group consisting of cuprates. The method has a low technical effort, since densification is possible without heating the starting material.