A system for cooling computer hardware includes a heat exchanger having a computer hardware contact surface configured to be in thermal contact with the computer hardware on a first side and to be in thermal contact with a cooling liquid on a second side, the second side being opposite to the first side. The system also includes a bracket configured to removably clamp the heat exchangerto the computer hardware.

Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus includes a carrier plate including a first surface to face a heatsink; a second surface opposite the first surface, and an aperture extending between the first and second surfaces, the aperture dimensioned to surround a semiconductor device, and a spring carried by the carrier plate, the spring to contact a surface of the semiconductor device proximate an outer edge of the semiconductor device.

An apparatus for grounding a heatsink utilizing an EMC spring press-fit pin includes a printed circuit board, a logic chip, a heatsink, and a grounding member, where the grounding member includes an integrated spring and a first terminal pin at a first end of the grounding member. The logic chip is electrically coupled to the printed circuit board and the heatsink is disposed on a top surface of the logic chip. The first terminal pin at the first end of the grounding member is disposed in a plated-through hole of the printed circuit, where the grounding member is configured to electrically couple the heatsink to the printed circuit board.

A cooling assembly for a computer module has a cooling device and a mounting device. The mounting device includes a rod shaped fastening element having a male thread and a stop. The fastening element is nonrotatable and movable along its axis with respect to the cooling device. The fastening element is guided through a first hole in the cooling device and a second hole in the computer module, when the cooling device is mounted on the computer module. The stop prevents the fastening element from sliding through the first and second holes. The mounting device also has an elastic element arranged along the axis of the fastening element that presses or pulls the stop away from the computer module. A nut on the mounting device is engageable with the male thread of the fastening element. The stop and the nut are arranged at opposite sides of the computer module.

One example heat sink includes a heat dissipation substrate, a connector, and a fastener. The heat dissipation substrate is configured to dissipate heat for a packaged chip located on a circuit board, and the heat dissipation substrate is located on a surface that is of the packaged chip and that is opposite to the circuit board. A first heat dissipation substrate and a second heat dissipation substrate of the heat dissipation substrate each have a heat conduction surface that conducts heat with a chip in the packaged chip. Different heat conduction surfaces correspond to different chips.

A chip package fabricating kit includes a metal cover, at least one screw, and at least one screw cap. The metal cover includes a cap portion and at least one leg. The cap portion substantially presses against the BGA package. The leg substantially presses a PCB board that loads the BGA package. The leg forms a concave space with the metal cover for substantially encompassing the BGA package. Each the screw screws through a corresponding leg from top to bottom. Each the screw screws the PCB board at a first side. The screw cap respectively corresponds to the screw and one leg. The screw cap caps and fixes a tail of its corresponding screw for affixing the PCB board. A height of the concave space is dynamically adjusted by adjusting a degree that the screw screws with the screw cap. Such that the concave space substantially clamps the BGA package.

The present disclosure concerns a mounting device for semiconductor packages, and a heat dissipation assembly with such a mounting device. The mounting device includes a bottom side comprising one or more cavities to house semiconductor packages, and a top side comprising a plurality of holes extending from the bottom side to the top side for accommodating contact pins of the semiconductor packages. A fixation mechanism fixes the mounting device to a heat dissipation structure.

An electrical connector assembly includes: a printed circuit board; an electrical connector seated upon the printed circuit board; an electronic package coupled to the electrical connector; a frame structure affixed to the printed circuit board; a metallic securing seat affixed to the frame structure and having plural securing posts; a heat sink positioned upon the electronic package and having plural through holes aligned with the securing posts; plural fasteners each extending through a corresponding through hole to engage a corresponding securing post and plural springs each compressed between an associated fastener and the heat sink; and a retention member mounted to a corresponding securing post for engaging the heat sink, wherein the retention member has a mounting part and a latching part pivoted to the mounting part.

A semiconductor device according to the present application includes: a current carrying unit having a semiconductor element; a case enclosing the current carrying unit; a heat dissipating plate located on a back side of the current carrying unit and the case; a plurality of thread fastening holes located in at least one of the case and the heat dissipating plate for fastening to an external heat dissipating system; and a plurality of tightening order display structures located near the respective thread fastening holes to display an order in which screws are tightened into the thread fastening holes.

A floating heat sink includes an elastic support and a heat dissipating piece. The elastic support is integrally formed and includes at least two fasteners and at least two elastic arms. The fasteners are configured to mount the heat dissipating piece. All the fasteners and all the elastic arms are arranged around the heat dissipating piece. Two ends of the elastic arm are both connected to the fastener, and the two ends of the elastic arm are arranged in a circumferential direction of the heat dissipating piece. A middle part of the elastic arm is configured to be connected to a board in a fastened manner, and the middle part of the elastic arm is bent toward the board.