Systems and method are provided for determining a reliability of a physically unclonable function (PUF) cell of a device. A first signal is provided to a first branch of a PUF cell and a second signal is provided to a second branch of the PUF cell, the first and second signals being provided in synchronization. A base PUF cell value is determined based on an output of the PUF cell produced by the first signal and the second signal. A third signal is provided to the first branch and a fourth signal is provided to the second branch, the third signal and fourth signal being provided out of synchronization. A stressed PUF cell value is determined based on an output of the PUF cell produced by the third signal and the fourth signal. The PUF cell is determined to be unusable based on a difference between the PUF cell value and the stressed PUF cell value.

An IC includes first-third power rails. The first-third power rails are located along corresponding first-third centerlines spaced apart by the same distance. A plurality of first logic cells is in first and second width that is an integer multiple of a unit width and a first semiconductor structure that includes multiple transistors. For each first logic cell in the first row, the first semiconductor structure is located entirely between the first and second centerlines. For each first logic cell in the second row, the first semiconductor structure is located entirely between the first and third centerlines. A multi-height logic cell includes a second height that is greater than the first height, and a second width that is at least the unit width. The second semiconductor structure includes at least two transistors. The second semiconductor structure is partially between the first and second centerlines and between the first and third centerlines.

A semiconductor structure is provided. A logic cell with a logic function includes a plurality of first transistors in an active region over a semiconductor substrate, a second transistor in the active region, a third transistor in the active region, and first and second isolation structures on opposite edges of the active region and extending along the first direction. Each first transistor includes a first gate electrode extending along the first direction. The second transistor includes a second gate electrode extending along the first direction. The third transistor includes a third gate electrode extending along the first direction. The first gate electrodes are disposed between the first and second isolation structures. The second gate electrode is disposed between the first gate electrodes and the first isolation structure. The third gate electrode is disposed between the first gate electrodes and the second isolation structure.

Systems and method are provided for determining a reliability of a physically unclonable function (PUF) cell of a device. A first signal is provided to a first branch of a PUF cell and a second signal is provided to a second branch of the PUF cell, the first and second signals being provided in synchronization. A base PUF cell value is determined based on an output of the PUF cell produced by the first signal and the second signal. A third signal is provided to the first branch and a fourth signal is provided to the second branch, the third signal and fourth signal being provided out of synchronization. A stressed PUF cell value is determined based on an output of the PUF cell produced by the third signal and the fourth signal. The PUF cell is determined to be unusable based on a difference between the PUF cell value and the stressed PUF cell value.

Systems and method are provided for determining a reliability of a physically unclonable function (PUF) cell of a device. A first signal is provided to a first branch of a PUF cell and a second signal is provided to a second branch of the PUF cell, the first and second signals being provided in synchronization. A base PUF cell value is determined based on an output of the PUF cell produced by the first signal and the second signal. A third signal is provided to the first branch and a fourth signal is provided to the second branch, the third signal and fourth signal being provided out of synchronization. A stressed PUF cell value is determined based on an output of the PUF cell produced by the third signal and the fourth signal. The PUF cell is determined to be unusable based on a difference between the PUF cell value and the stressed PUF cell value.

In a semiconductor integrated circuit device using three-dimensional transistor devices, a delay cell having a large delay value per unit area is implemented. A first cell, which is a logic cell, includes three-dimensional transistor devices. A second cell, which is a delay cell, includes three-dimensional transistor devices. The length by which a second local interconnect protrudes from a second solid diffusion layer portion in a direction away from a power supply interconnect in the second cell is greater than the length by which a first local interconnect protrudes from a first solid diffusion layer portion in a direction away from the power supply interconnect in the first cell.

In a semiconductor integrated circuit device using three-dimensional transistor devices, a delay cell having a large delay value per unit area is implemented. A first cell, which is a logic cell, includes three-dimensional transistor devices. A second cell, which is a delay cell, includes three-dimensional transistor devices. The length by which a second local interconnect protrudes from a second solid diffusion layer portion in a direction away from a power supply interconnect in the second cell is greater than the length by which a first local interconnect protrudes from a first solid diffusion layer portion in a direction away from the power supply interconnect in the first cell.

A structure for extracting interconnect parasitic in a ring oscillator is disclosed. The ring oscillator comprises multiple logical units connected in head to tail series. The structure comprises parasitic resistance sub-structures and/or parasitic capacitance sub-structures each connected to a corresponding logical unit. The structure can be used to determine errors in extracting parasitic resistance of polysilicon interconnects and metal interconnects, and/or errors in extracting parasitic capacitance between the polysilicon interconnects and between the metal interconnects. Therefore, the parasitic extraction error can be calibrated accordingly to obtain more precise circuit simulation results and more accurate device model and BEOL model.