The present invention relates to a substrate cleaning system and a substrate cleaning method for cleaning a substrate. The substrate cleaning system (50) includes a heater (51), a chemical-liquid diluting module (52), and a cleaning module. A temperature of the diluted-chemical-liquid mixed by the chemical-liquid diluting module (52) is determined to be higher than normal a temperature and lower than a glass transition point of a cleaning member. The cleaning member scrubs the substrate (W) with the diluted chemical liquid having the determined temperature supplied to the substrate (W).

The present disclosure provides a roller for cleaning a backside of a wafer. The backside of the wafer has a central region and a periphery region surrounding the central region. The roller includes an upper element, a bottom element, and an axis element for connecting the upper element and the bottom element. The upper element of the roller is configured to contact with a frontside of the wafer. The bottom element is configured to contact with the backside of the wafer and remove particles from the periphery region of the backside of the wafer. The bottom element is made of materials selected from a group comprising abrasive pads, sand papers, and asbestos.

An apparatus for producing semiconductor cells, the apparatus comprises a printing device for printing on a semiconductor cell, a monitoring device configured to monitor characteristics of the printed semiconductor cell, and a cleaning device configured for cleaning at least one part of the printing device based on the monitored characteristics of the semiconductor cells.

A device includes: state information acquisition unit that acquires state information including position of substrate in the device and elapsed time in each unit; action selection unit having prediction model that predicts value, in a certain state, to performing action whether to take out new substrate from the cassette and to which processing unit substrate is transferred, the action selection unit selecting one action based on the prediction model taking, as input, the acquired state information; instruction signal transmission unit that transmits instruction signal so as to perform the selected action; operation result acquisition unit that acquires operation result including number of substrates processed and waiting time; and prediction model update unit that calculates reward based on acquired operation result such that reward increases as the number of substrates processed increases and waiting time is short and that updates the prediction model based on the reward.

A substrate cleaning method includes: arranging a substrate within a processing container; spraying gas from a spray port of a gas nozzle arranged within the processing container; causing vertical shock waves, generated by spraying the gas from the gas nozzle, to collide with a main surface of the substrate; and removing particles adhering to the main surface of the substrate, by causing the vertical shock waves to collide with the main surface of the substrate.

Providing a substrate cleaning device and a substrate cleaning method having high detergency. Provided is a substrate cleaning device including: a substrate rotating mechanism that rotates a substrate; and a first nozzle and a second nozzle that eject an ultrasonic cleaning solution toward a predetermined surface of the substrate that is rotated, wherein the first nozzle and the second nozzle are held in one casing.

The cleaning apparatus includes multiple kinds of cleaning modules each configured to perform a cleaning processing of a substrate, a first accommodating section configured to accommodate the multiple kinds of cleaning modules therein, and a fluid supply section configured to supply a fluid to the cleaning modules accommodated in the first accommodating section through a pipe. Each of the multiple kinds of cleaning modules includes a pipe connection portion having a common connection position to be connected with the pipe.

Provided is disclosure for hybrid material post-CMP brushes and methods for forming the same. Embodiments of a hybrid material post-CMP brush may comprise at least two layers, where the hybrid brush is used to clean various surfaces, such as surfaces of semiconductor substrates. An example hybrid brush for cleaning a surface includes a mandrel, a molded first layer formed about the mandrel, where the molded first layer comprises a first material, and a molded second layer surrounding the molded first layer, where the molded second layer comprises a second material.

A sponge roller is made of a polyvinyl acetal porous resin material having elasticity in a wet state, includes a roller in an approximate cylinder form and a plurality of protrusions formed integrally on an outer peripheral surface of the roller, and rotates the multiple protrusions to make contact with a surface to be cleaned so as to clean the surface. The polyvinyl acetal porous resin material constituting the sponge roller contains a cationic functional group.

A substrate processing device includes a processing container; a substrate holder configured to hold a substrate arranged within the processing container; a gas nozzle configured to spray gas within the processing container; a controller configured to control collision of the gas with the substrate held by the substrate holder. The controller is configured to remove particles adhering to the main surface of the substrate, by causing the vertical shock waves to collide with the main surface of the substrate.