An adsorption device includes a substrate and a magnetic film on a surface of the substrate. The substrate has magnetic properties and is capable of generating magnetic field. The magnetic film partially covers the surface. The magnetic film generates a magnetic field having a direction that is opposite to a direction of the magnetic field generated by the substrate. Portions of the surface of the substrate not covered by the magnetic film form positions to attract and adsorb target objects, and other portion of the surface of the substrate covered by the magnetic film is not able to attract any target object.

Introduced here are carrier assemblies designed to address the limitations of conventional carrier trays. A carrier assembly can comprise a primary injection-molded component having a deck area for receiving semiconductor components and a secondary injection-molded component that is secured to the deck area of the primary injection-molded component. For example, the secondary injection-molded component may be overmolded on the deck area of the primary injection-molded component. The secondary injection-molded component may have a tacky upper surface that facilitates securement of the semiconductor components to the primary injection-molded component.

A substrate for manufacturing a display device according to the present invention includes a base part; assembly electrodes extending in one direction and disposed on the base part at predetermined intervals; an etch stop layer formed on at least a portion of the base part; a barrier wall part formed on the etch stop layer while forming a cell on which a semiconductor light emitting device is mounted along an extension direction of the assembly electrodes. The etch stop layer is formed on at least a first region in which the assembly electrodes are formed among the entire region of the base part.

A transferring method includes providing an adsorption device, using the adsorption device to attract and hold a plurality of light emitting diodes (LEDs), providing a target substrate with a plurality of spots of anisotropic conductive adhesive on a surface of the target substrate; moving the adsorption device or the target substrate wherein each of the plurality of LEDs adsorbed by the adsorption device becomes in contact with one of the plurality of spots of anisotropic conductive adhesive; and curing the plurality of spots of anisotropic conductive adhesive on the target substrate and moving away the adsorption device.

A method for making an adsorption device includes: providing and etching a substrate to form a plurality of receiving grooves spaced apart from each other; forming a magnetic film in each of the plurality of receiving grooves; and forming a magnet in each of the plurality of receiving grooves. Each receiving groove includes a bottom wall and a side wall coupling the bottom wall. The magnetic film covers the bottom wall and the side wall of each of receiving groove.

In one embodiment, a tray that includes a dielectric frame structure, a re-adherable pad and a marking is disclosed. The dielectric frame structure includes a recessed region where the re-adherable pad is formed. A plurality of integrated circuits is placed on a re-adherable surface of the re-adherable pad. The marking on the dielectric frame that is reflective of a given input-output pin position for each integrated circuit in the plurality of integrated circuits in the tray. In addition to that, two methods are also disclosed. First, a method of handling the integrated circuits using the tray is disclosed. Second, a method of forming the tray is also disclosed.

Provided are a semiconductor-accommodating tray and a cover therefor. The semiconductor-accommodating tray includes a heat-resistant base plate, a plurality of pocket parts disposed on the heat-resistant base plate and configured to accommodate semiconductor devices, a guide part disposed at an edge of each pocket part, and a carbonaceous conductive material layer coated on surfaces of the heat-resistant base plate, the pocket parts, and the guide parts. When the semiconductor-accommodating tray and the cover therefor are used, production of particles significantly decreases, and low and uniform electric resistance and excellent antistatic effects are obtained.

A substrate carrier unit includes a substrate carrier and a phase transition material. The substrate carrier defines an isolated space therein. The phase transition material is filled into the isolated space of the substrate carrier and has a melting point ranging between 18° C. and 95° C. The phase transition material is capable of absorbing thermal energy from the substrate carrier as latent heat to change the phase from solid to liquid.

A method for making an adsorption device includes: providing and etching a substrate to form a plurality of receiving grooves spaced apart from each other; forming a magnetic film in each of the plurality of receiving grooves; and forming a magnet in each of the plurality of receiving grooves. Each receiving groove includes a bottom wall and a side wall coupling the bottom wall. The magnetic film covers the bottom wall and the side wall of each of receiving groove.

An automated-position-aligning method for transferring chips includes forming a chip-carrier base, applying a liquid, disposing a chip, transporting a carrier substrate and transferring the chip. A related system includes a carrier substrate, a liquid applying device, a chip disposing device, a carrier substrate transporting device and a chip transferring device. A carrier surface of the carrier substrate is crisscrossed by spacing grooves to form chip-carrier bases thereon. The carrier surface is hydrophilic, and the spacing grooves are hydrophobic. The liquid gathers on the chip-carrier bases. A plurality of chips are positioned and attached on the respective chip-carrier bases by surface free energy of the liquid. An electromagnetic wave radiates to the carrier substrate to heat and evaporate the liquid between each chip-carrier base and each chip such that the chips are released from the chip-carrier bases and fall to a receiving surface of a receiving substrate.