A package structure includes a backing plate, at least one pad, a frame, a side enclosing plate, a magnetic component and a fixing structure. The backing plate supports a target object. The pad is disposed on the backing plate and fixes the target object. The frame is disposed on a lower side of the backing plate and bonded to the backing plate. The frame supports the backing plate to fix the pad onto the backing plate. The side enclosing plate is disposed around the backing plate and connected to the pad to fix the pad. The magnetic component is disposed on the backing plate and attracting a magnetic coating on the target object. The fixing structure is disposed at an end portion of the frame and connected to the pad to fix the pad.

A semiconductor wafer is as wide as the industry standard width A (presently 156 mm+/−1 mm) and is longer than the industry standard A by at least 1 mm and as much as the standard equipment can reasonably accommodate, presently approximately 3-20 mm and potentially longer, thus, gaining significant additional surface area for sunlight absorption. Modules may be composed of a plurality of such larger wafers. Such wafers can be processed in conventional processing equipment that has a wafer retaining portion of industry standard size A and a configuration that also accommodates a wafer with a perpendicular second edge longer than A by at least 1 and typically 3-20 mm. Wet bench carriers and transport and inspection stations can be so used.

A dummy panel transport apparatus includes: an adsorption unit including an injection hole into which compressed air is injected, a discharge hole to which the compressed air is discharged, and a suction hole in which an external air is sucked; an adsorption unit holder supporting the adsorption unit, and movable in a first direction and a direction opposite to the first direction; a plate disposed under the adsorption unit holder; a plate holder supporting the plate, and movable in a second direction crossing the first direction and in a direction opposite to the second direction; a dummy storage part disposed under the plate; a brush unit disposed on the plate; and a brush unit holder supporting the brush unit, and movable in the first direction, in the direction opposite to the first direction, in the second direction, and the direction opposite to the second direction.

A package structure comprises a backing plate supporting a target object, at least one pad disposed on the backing plate and fixing the target object, a frame disposed on a lower side of the backing plate, bonded to the backing plate, and supporting the backing plate to fix the pad onto the backing plate, and a side enclosing plate disposed around the backing plate and connected to the pad to fix the pad. The package structure further comprises a magnetic component disposed on the backing plate and attracting a magnetic coating on the target object.

Various embodiments herein relate to carriers for supporting one or more substrate as the substrates are passed through a processing apparatus. In many cases, the substrates are oriented in a vertical manner. The carrier may include a frame and vertical support bars that secure the glass to the frame. The carrier may lack horizontal support bars. The carrier may allow for thermal expansion and contraction of the substrates, without any need to provide precise gaps between adjacent pairs of substrates. The carriers described herein substantially reduce the risk of breaking the processing apparatus and substrates, thereby achieving a more efficient process. Certain embodiments herein relate to methods of loading substrates onto a carrier.

The present disclosure provides a support device for conveying at least one solar cell element in a transport direction, wherein the support device comprises a support element configured for supporting the at least one solar cell element and an electric arrangement configured for providing an electrostatic force for holding the at least one solar cell element on the support element.

The present disclosure provides a support device for conveying at least one solar cell element in a transport direction, wherein the support device comprises a support element configured for supporting the at least one solar cell element and an electric arrangement configured for providing an electrostatic force for holding the at least one solar cell element on the support element.

A batch processing oven includes a processing chamber, a magnet, and a rack. The processing chamber includes a gas inlet on a first side and a gas outlet on a second side opposite the first side, the gas inlet is configured to direct a hot gas into the processing chamber and the gas outlet is configured to exhaust the convective energy in parallel with the radiative energy from the walls. The magnet is arranged such that its north pole will be formed on the first side of the processing chamber and its south pole will be formed on the second side of the processing chamber. The rack is configured to be positioned between the first and second ends of the processing chamber and is configured to support a plurality of vertically spaced-apart substrates.

A load port adapter is a load port adapter fixable on a mounting table of a load port. The load port adapter includes a holder capable of holding a cassette capable of accommodating a plurality of circuit boards. The holder is fixable on the mounting table of the load port. The holder includes a position adjustment mechanism configured to position the cassette at a reference position. In the cassette clamped on the load port adapter, the reference position is a reference position on a load port adapter side when the circuit board is taken out from the cassette.

Various embodiments herein relate to carriers for supporting one or more substrate as the substrates are passed through a processing apparatus. In many cases, the substrates are oriented in a vertical manner. The carrier may include a frame and vertical support bars that secure the glass to the frame. The carrier may lack horizontal support bars. The carrier may allow for thermal expansion and contraction of the substrates, without any need to provide precise gaps between adjacent pairs of substrates. The carriers described herein substantially reduce the risk of breaking the processing apparatus and substrates, thereby achieving a more efficient process. Certain embodiments herein relate to methods of loading substrates onto a carrier.