A cover tape for packing an electronic component includes: a substrate layer; a heat sealing layer placed on one surface side of the substrate layer; and an intermediate layer placed between the substrate layer and the heat sealing layer, and a transmitted image definition based on JIS K 7374, with an optical comb width set to 0.5 mm, is 30% or more.

A system includes a factory interface, a load port connected to the factory interface, a container connected to the load port, and a controller connected to a robot arm of the factory interface. The controller determines that the container is configured to store replacement parts for a process chamber of the system and causes the robot arm to move according to a first mapping pattern to identify, using a detection system at a distal end of an end effector of the robot arm, positions in the container. Regions of the container that do not contain replacement parts are determined and the robot arm is moved according to a second mapping pattern to identify a position in the container of a wafer and/or an empty carrier for a replacement part. A mapping of positions of replacement parts and positions of the wafer and/or empty carrier is recorded in a storage medium.

The present disclosure relates to the technical field of semiconductors, and proposes a semiconductor chip container and a fixture. The container is placed in a containing device with a chemical reagent, and the container includes a main body and partition plates, where the main body has an accommodating space; the partition plates are arranged in the accommodating space and divide the accommodating space into a plurality of independent accommodating chambers; the plurality of accommodating chambers are respectively used for placing a plurality of independent semiconductor chips; the main body is provided with first through holes; the first through holes are used for allowing the chemical reagent to enter the accommodating space; the main body and the partition plates are used for preventing the semiconductor chip from being separated from the corresponding accommodating chamber under the action of the chemical reagent.

Discussed is an assembly chamber containing a fluid. The assembly chamber includes a bottom portion, a side wall portion formed at a predetermined height on the bottom portion and disposed to surround the bottom portion, and a partition wall part formed on the bottom portion and extending from one inner surface of a plurality of inner surfaces provided in the side wall portion to another inner surface facing the one inner surface. The vertical height of at least a portion of the partition wall part is variable with respect to the bottom portion.

Examples of molded substrates are described herein. In some examples, a molded substrate may support integrated circuitry. In some examples, the molded substrate and the integrated circuitry are included in a circuitry package for a replaceable print component. In some examples, the molded substrate is relatively flat. In some examples, molding remnants may be on the molded substrate.

A method for detecting positions of replacement parts, wafers, or empty carriers for a replacement part stored at a replacement parts storage container is provided. A container is received at a at a load port of a factory interface of an electronics processing system. The container is configured to store replacement parts for a process chamber of the electronics processing system. A robot arm is moved according to a first mapping pattern to identify, using a detection system at a distal end of an end effector of the robot arm, positions of one or more replacement parts in the container. Regions of the container that do not contain replacement parts are determined. The robot arm is moved according to a second mapping pattern to identify, within the regions of the container that do not contain replacement parts, using the detection system, a position in the container of at least one of a wafer or an empty carrier for a replacement part. A mapping of positions of the one or more replacement parts and of positions of at least one of the empty carrier or the wafer in the container is recorded in a storage medium.

To protect a plurality of semiconductor chips of a sawn wafer housed in a shipping case and a method of manufacturing a semiconductor device includes a step of vacuum packing a sawn wafer while being housed in a shipping case; the shipping case has the following structure: the shipping case has a lid portion that covers the upper surface of the sawn wafer and a body portion that covers the lower surface of the sawn wafer, the lid portion has a recess portion that covers a plurality of semiconductor chips and a ventilation route communicated with the recess portion. In a step of reducing pressure in the shipping case, a gas in the shipping case is discharged outside via a ventilation route.

A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.

The present invention relates to a chip counter, which transmits an X-ray beam through a tape reel around which a tape having a plurality of semiconductor chips mounted in a row therein is wound, acquires an image scattered or diffracted by the semiconductor chips, and processes the acquired image, so as to count the number of the semiconductor chips, wherein: the X-ray beam transmitted through the tape reel (1) is sensed by a fluorescent intensifying screen (60); a fluorescent light emitted from the fluorescent intensifying screen (60) according to the sensing of the X-ray beam is captured by a camera (70), so that the number of the semiconductor chips is counted from an image in which the semiconductor chips are displayed by a dotted image; and the camera (70) is protected by an X-ray beam shielding member (100: 110; 120; and 130).

A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.