Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.

An apparatus includes a reticle pod. The reticle pod includes a baseplate having a first surface, a cover having a second surface, and at least one layer. The first surface includes a first mating surface. The second surface includes a second mating surface. The at least one layer is bonded to one or more of at least a part of the first mating surface and at least a part of the second mating surface. The first surface and the second surface overlap at the first mating surface and the second mating surface when the cover is attached to the baseplate.

A SiC film structure for obtaining a three-dimensional SiC film by forming the SiC film in an outer circumference of a substrate using a vapor deposition type film formation method and removing the substrate, the SiC film structure including: a main body having a three-dimensional shape formed of a SiC film and having an opening for removing the substrate; a lid configured to cover the opening; and a SiC coat layer configured to cover at least a contact portion between the main body and an outer edge portion of the lid and join the main body and the lid.

The present invention provides a wafer container and a gas diffusion device applied in the wafer container. The wafer container includes a shell, and all components included and applied on the shell are made of thermal resistance materials. The gas diffusion device and the wafer container, when assembled together, utilize a coupling structure and a collar as a protection mechanism for the gas diffusion device. The gas diffusion device has a buffering chamber that provides a buffering tolerance and a communicating space for the gas before the gas enters an interior space of the wafer container.

This technical disclosure describes a device that includes a recital pod and the method of making and maintaining the pod. The device includes a pod that includes a cover including a cover body; a baseplate including a baseplate body; and one or more mating surfaces formed on one or both of the baseplate body and the cover body to assemble between the cover and the baseplate to each other. The one or more mating surfaces each includes an outermost coating configured to be wear-resistant and lubricating, the outermost coating includes a composite metal plating, and the composite metal plating includes a metal plating with a lubricant embedded therein and/or layered over the metal plating.

A semiconductor fabrication building is provided. The semiconductor fabrication building includes an ambient control surrounding and a makeup air handling unit configured to supply clean air to the ambient control surrounding. The makeup air handling unit includes a housing having an air inlet and an air outlet. The makeup air handling unit also includes a first filtration module positioned in the housing. The first filtration module includes a number of hollow fibers configured to guide air to flow from the air inlet to the air outlet. A porous layer is formed at an inner wall of each of the hollow fibers to filter airborne molecular contamination (AMC) having a selected size.

The container main body includes a tubular wall portion having an opening circumferential portion provided at one end portion and the other end portion being closed, the opening circumferential portion having a container main body opening portion formed therein. The substrate storing space can store a substrate and communicates with the container main body opening portion. A central fixed member is provided to the wall portion of the container main body so as to be removably attached to the wall portion of the container main body. The central fixed member is configured to be locked and fixed to an alignment portion provided at a load port for conveying the substrate stored in the substrate storing space to a processing apparatus.

A drying block structure is provided, including a main body and a protective layer. The main body has a honeycomb and substantially circular shape. The protective layer covers the main body and has a porous structure. The main body and the protective layer are integrally formed as one piece.

A front opening wafer container has a container portion and a door sized to close an open front of the container portion. The container portion has shelves for holding wafers defining a seating position and has forward and rearward wafer supports to suspend wafers therebetween in a transport position above the seating position. Shock condition cushion portions are arranged adjacent the transport position for protecting the wafers during a shock condition. The wafers may be bonded wafers having a thinned wafer side and a carrier substrate side. Wafer engagement pads and finger members extend in opposing directions from a central strip on the door providing a balance wafer engagement. When closing the door, a primary wafer support portion engages the wafers first and a secondary elastomeric wafer support engages the wafer secondly. A V-groove for receiving the wafers in the wafer supports has a greater angle defined between the V-groove and the thinned wafer side than the angle defined between the V-groove and carrier substrate side providing enhanced protection for the bonded wafers.

Reticle pod inner pods include a cover and a baseplate, with the cover and the baseplate contacting one another at contact surfaces. The contact surfaces of the cover and the baseplate each include different materials. The different materials can each be metals. The different materials can differ in hardness. The difference in hardness can be 50 Brinell hardness or greater. One of the different materials can be a ductile material, having elongation at break of 25% or greater. Methods can include providing the cover and the baseplate each including a first material, and providing a second, different material at the contact surfaces of one of the cover or the baseplate.