A processing apparatus includes a wafer cassette table, a wafer carrying-out mechanism, a wafer table, a frame housing unit, a frame carrying-out mechanism, a frame table, a tape sticking unit, a tape-attached frame conveying mechanism, a tape pressure bonding unit, a frame unit carrying-out mechanism, a reinforcing part removing unit, a ring-free unit carrying-out mechanism, and a frame cassette table. The wafer carrying-out mechanism includes a Bernoulli chuck mechanism that jets gas to the back surface of the wafer and generates a negative pressure. The gas jetted by the Bernoulli chuck mechanism is inert gas. The wafer carrying-out mechanism jets the inert gas from the Bernoulli chuck mechanism to suppress oxidation of the back surface of the wafer when the wafer is carried out.

Systems and techniques for determining and correcting inter-wafer misalignments in a stack of wafers transported by a wafer handling robot. An enhanced automatic wafer centering system is provided that may be used to determine a smallest circle associated with the stack of wafers, which may then be used to determine whether or not the stack of wafer meets various process requirements and/or if a centering correction can be made to better align the wafers with a receiving station coordinate frame.

A printing device for printing substrates, such as circuit boards, wafers, or solar cells, has at least one movably mounted printing unit with a working surface on which the substrate to be printed can be placed. The printing unit is paired with a transport belt device, which has a supply roller with a transport belt wound thereon, a collection roller for winding up the transport belt, and two deflecting surfaces, in particular deflecting rollers, which are paired with the working surface. The transport belt is guided by the supply roller over one deflecting surface and onto the working surface in order to form a contact surface for the substrates, and by the working surface over the other deflecting surface to the collection roller. The deflecting surfaces can be moved together with the respective printing unit. The supply and collection rollers are held on the printing device in a stationary manner.

The invention relates to a device 10 for holding workpieces 30 in a process chamber. The invention additionally relates to a coating system 20 and to a method for coating a workpiece 30. In order to allow for precise adjustment of the height of the position of workpieces 30 while supporting same in a secure and stable manner, the holding device 10 comprises a tray 72 for the workpieces 30, a height-adjustable first support element 22 and a height-adjustable second support element 48 for the tray 72, wherein each of the support elements 22, 48 comprises at least one first and one second limb element 26, 56, wherein the respective first and the respective second limb element 26, 56 are coupled so as to be pivotable relative to one another about a pivot axis X, Y, and wherein the pivot axis X of the first support element 22 is arranged at an angle to the pivot axis Y of the second support element 48.

A transfer apparatus includes a lower plate including a lower link arm and a lower support, the lower support being fixed to an upper surface of the lower plate, an upper plate on the lower plate and configured to support a wafer stacking box on an upper surface of the upper plate, the upper plate including an upper link arm, and an upper support that is fixed to the upper surface of the upper plate, and a fixing member that is connected to the upper link arm, the fixing member configured to selectively contact the wafer stacking box. The upper plate is aligned with the lower plate in a first horizontal direction, and is configured to perform linear movement on the lower plate in the first horizontal direction.

A tower lift includes a main frame extending in a vertical direction, a carriage module configured to be movable in the vertical direction along the main frame, a weight module disposed behind the carriage module and configured to be movable in the vertical direction along the main frame, a driving module disposed on the main frame and configured to move the carriage module and the weight module in the vertical direction using at least one timing belt, an auto tensioner disposed on a lower portion of the main frame and connected with the carriage module and the weight module by a balance belt, and an upper alignment unit for aligning a horizontal position of the at least one timing belt.

The present application relates to a substrate transfer device, comprising a horizontally arranged cross beam, and support beams longitudinally arranged at two ends of the cross beam, wherein a substrate carrier is suspended on the cross beam, the substrate carrier is located between the two support beams, and the substrate carrier is parallel to a plane where the two support beams are located, the substrate carrier comprises two side walls oppositely arranged in a horizontal direction, and each of the support beams is provided with an auxiliary clamping structure for clamping the substrate carrier during transferring of the substrate carrier.

A system includes a plurality of spindle arms located above a plurality of stations in a processing chamber to transport a semiconductor substrate between the stations. The spindle arms reside in the processing chamber during processing of the semiconductor substrate. The system comprises first gas lines arranged below the stations to supply a purge gas. The system comprises second gas lines extending upwards from the first gas lines to supply the purge gas to the spindle arms during the processing of the semiconductor substrate in the processing chamber.

A turnaround mechanism of silicon wafers is provided. The turnaround mechanism includes a material frame, a supporting component, a second clamping component. The frame is provided with a material tank. The supporting component includes at least one first clamping component, and each of the at least one first clamping component is configured to clamp or release a support. The second clamping component includes two first rotating shafts disposed oppositely and two second clamping members, the two first rotating shafts are rotatably connected to the material frame, the two second clamping members are correspondingly disposed on the two first rotating shafts respectively, and each of the two second clamping members can rotate with a corresponding first rotating shaft, enabling the two second clamping members to move toward each other to clamp the silicon wafers to be separated.

A wafer inspection system is provided. The wafer inspection system comprises: a transfer region in which a transfer device is arranged; an inspection region in which test heads for inspecting a substrate are arranged; and a maintenance region in which the test heads are maintained. The inspection region is located between the transfer region and the maintenance region, a plurality of inspection rooms accommodating the test heads are adjacent to each other in the inspection region, and the test heads are configured to be unloaded from the inspection region to the maintenance region.