A storage apparatus for storing an object includes a load port unit that a receptacle is loaded onto or unloaded from, in which the receptacle accommodates the object in a storage space formed by a body and a cover that covers the body, and a controller. The load port unit includes a housing having an interior space, a stage member that is provided on the housing and that opens the storage space by moving the body, the receptacle being seated on the stage member, and an exhaust tube that evacuates a spacing space between the body and the cover spaced apart from each other. One end of the exhaust tube faces toward the spacing space, and an opposite end of the exhaust tube faces toward the interior space.

There is provided a load port, including: a frame including an opening via which a transfer target object is capable of passing in a substantially horizontal posture; a load port door configured to engage with a container door capable of opening and closing a loading/unloading port of a storage container including slots capable of accommodating the transfer target object in a multi-stage manner, and to open and close the opening of the frame; and a mapping mechanism configured to map information on an accommodation state including presence or absence of the transfer target object in each of the slots in the storage container via the opening and the loading/unloading port.

With respect to an accommodation container that accommodates a substrate-shaped sensor, the accommodation container includes a container body that has an opening, a support that is disposed inside the container body and configured to support the substrate-shaped sensor, a contact pin that is disposed inside the container body and configured to come into contact with a terminal portion of the substrate-shaped sensor, a driving mechanism that is disposed inside the container body and configured to drive the contact pin, a rotation shaft member that drives the driving mechanism from an outside of the container body, a jack that is disposed outside the container body and electrically connected to the contact pin, and a lid that is configured to close the opening of the container body.

One or more embodiments described herein generally relate to drying environments within semiconductor processing systems. In these embodiments, substrates are cleaned and dried within a drying environment before returning to the factory interface. However, due to an opening between the factory interface and the drying environment, air flows from the factory interface into the drying environment, often reducing the effectiveness of the drying processes. In embodiments described herein, the air flow is blocked by a sliding door that raises up to the closed position when a substrate enters the drying portion of the dryer located within the drying environment. After the substrate exits the dryer and before the substrate enters the factory interface, the sliding door lowers to the opened position such that the substrate can enter the factory interface. As such, these processes allow for multiple substrates to dry quickly and consistently within the system, improving throughput.

A substrate processing apparatus includes: a substrate processing part including a load port configured to place thereon a substrate accommodating vessel in which at least one substrate is accommodated, and configured to take out the at least one substrate from the substrate accommodating vessel and to perform a series of processes on the at least one substrate; and a controller configured to control an opening and closing of a lid of the substrate accommodating vessel, wherein the controller performs control to open the lid after the substrate accommodating vessel is placed on the load port, and the controller performs control to close the lid when an abnormality occurs in the substrate processing part and when none of the at least one substrate removed from the substrate accommodating vessel can be recovered to the substrate accommodating vessel after a predetermined period of time from the occurrence of the abnormality.

The present disclosure relates to the technical field of semiconductors, and provides a mask pod and a semiconductor device. The mask pod includes: a body, wherein the body has an accommodation space configured to accommodate a mask, the accommodation space has a first opening, and the first opening is located on a circumferential side of the body; and a shielding member, wherein the shielding member is provided on the body and is movably provided relative to the body, to shield or release the first opening.

A substrate storage apparatus includes a stage on which a cassette that has a lid detachably mounted to an opening is disposed, a lid attaching/detaching plate that performs attaching/detaching of the lid to/from the opening of the cassette disposed on the stage, and is provided to be movable between a mounting position in contact with the lid disposed at a position of the opening and a retracted position not in contact with the lid disposed at the position of the opening, a lid holding sensor that detects whether the lid is being held by the lid attaching/detaching plate, and a controller that determines presence/absence of abnormality related to attachment/detachment of the lid based on a detection result of the lid holding sensor.

Cassette lid opening device for a semiconductor substrate processing apparatus comprising a housing, a door assembly, a transport mechanism, and at least one suspension. The housing has at least one wall with an associated wall opening. The door assembly comprises at least one door plate configured for substantially closing off the associated wall opening of the at least one wall. The transport mechanism includes a carriage which is connected to the door assembly and configured to transport the door assembly parallel to the at least one wall. The at least one suspension is arranged between the at least one door plate and the transport mechanism. The at least one suspension comprises a suspension spring assembly which allows movement of the at least one door plate in a direction perpendicular to the at least one wall.

Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.

A substrate housing container (1) includes (i) a container body (10) having one end that is provided with an opening (11) and another end that is provided with a mount element (12) on which substrates (W) are stacked, the mount element 12 facing the opening (11), and (ii) a cover (20) to cover the opening (11), wherein the cover (20) includes a lid portion (21) to cover the opening (11) and at least two holding members (22) disposed on the lid portion (21), the holding members (22) being configured to swing in a central direction of the lid portion (21) and to press outer sides of the substrates (W) accommodated in the container body (10) with the substrates (W) stacked, the container body (10) has guide grooves (13) to make tips (22a) of the holding members (22) move from an outer side of the mount element (12) to an inner sides of the mount element (12) to guide the tips (22a) of the holding members (22) to positions at which the holding members (22) press the outer sides of the substrates (W), and the guide grooves (13) are formed as a dent on surfaces of the mount element (12).