Disclosed is a substrate treating apparatus that performs a cleaning treatment on substrates. A treating block includes a plurality of treating units in an upper and lower stages, respectively. The treating block includes a front face cleaning unit and a back face cleaning unit, each being at least one in number, in the upper stage. The treating block includes at least one tower unit including the front face cleaning unit and the back face cleaning unit, each being at least one in number, in the lower stage. Moreover, a transportation block is provided that includes a center robot in each of the upper and lower stages.

Systems and techniques for determining and correcting inter-wafer misalignments in a stack of wafers transported by a wafer handling robot. An enhanced automatic wafer centering system is provided that may be used to determine a smallest circle associated with the stack of wafers, which may then be used to determine whether or not the stack of wafer meets various process requirements and/or if a centering correction can be made to better align the wafers with a receiving station coordinate frame.

Disclosed is a substrate treating apparatus for performing a cleaning treatment on substrates. The apparatus includes an indexer block with an indexer robot, a treating block including a front face cleaning unit and a back face cleaning unit as treating units, and a reversing path block including a plurality of shelves on which substrates are placed, and having a reversing function. The indexer robot includes a guide rail, a base, an articulated arm, and a hand. The guide rail is positioned so as not to overlap a mount position of a substrate in the reversing path block.

An embodiment comprises: a guide moving in the vertical direction or the horizontal direction; a transfer arm provided on the guide and loading spaced apart wafers; a laser emission unit disposed on the guide and emitting first laser beams at the spaced apart wafers loaded on the transfer arm; and a laser detection unit disposed below the transfer arm and collecting, from among the first laser beams, second laser beams having passed through gaps between the spaced apart wafers.

A transport system for transporting a plurality of objects between a storage container configured to store the plurality of objects and a processing apparatus configured to collectively process the plurality of objects held on a tray, including a mounting part on which the storage container is mounted, a stage on which the plurality of objects are mounted, a tray support part configured to support the tray, a first transport device configured to transport the plurality of objects between the storage container mounted on the mounting part and the stage, and a second transport device configured to transport the plurality of objects between the stage and the tray supported by the tray support part.

According to one aspect of the technique of the present disclosure, there is provided a method of displaying substrate arrangement data, including: (a) setting each of a transport parameter for determining at least an arrangement of substrates to be loaded into a substrate retainer and carrier information of a carrier storing the substrates to be loaded into the substrate retainer; (b) creating the substrate arrangement data of a case where the substrates are loaded into the substrate retainer based on the transport parameter and the carrier information set in (a); and (c) displaying the substrate arrangement data at least comprising data representing the arrangement of the substrates in a state where the substrates are loaded in the substrate retainer.

A substrate transfer device includes a substrate holder and a base to which the substrate holder is movably attached. The substrate holder includes first and second suction holes provided to be open in a placing surface, first and second protrusions disposed respectively in the first and second suction holes, and first and second supports provided respectively in the vicinity of the first and second suction holes so as to protrude upward from the placing surface. The first protrusion is pressed by a first elastic member toward an upward direction to protrude from the first suction hole such that the first protrusion blocks the first suction hole, and the second protrusion is pressed by a second elastic member toward an upward direction to protrude from the second suction hole such that the second protrusion blocks the second suction hole.

A substrate processing technology including: transferring a substrate to a process chamber and mounting the substrate on a substrate holder; heating the substrate with a heating device to perform predetermined substrate processing; determining the number of times of the predetermined substrate processing that has been performed that the predetermined substrate processing has been performed a preset number of times or more, determining whether it is necessary to adjust a mounting position at which the substrate is mounted on the substrate holder; and when it is determined that a mounting position adjustment is necessary, determining the mounting position by comparing the substrate temperature measured at the performing the predetermined substrate processing with a premeasured temperature of the substrate which corresponds to the mounting position and is stored in a memory.

An illustrative embodiment disclosed herein is an apparatus including a first loading tray configured to couple to a first wafer holding device holding a plurality of wafers. The first wafer holding device includes a first opening. The apparatus includes a second loading tray configured to couple to a second wafer holding device. The second wafer holding device includes a second opening. The apparatus includes a first motor coupled to the first loading tray and configured to rotate the first wafer holding device until the first opening faces the second opening to allow transfer of the plurality of wafers from the first wafer holding device to the second wafer holding device.

The present disclosure, in some embodiments, relates to an integrated chip processing tool. The integrated chip processing tool includes a first transfer module and a second transfer module. The first transfer module has a first robotic arm disposed within a housing. The first transfer module is configured to receive a single and unitary first die tray configured to hold a plurality of integrated chip (IC) die and to concurrently transfer all of the plurality of IC die held by the single and unitary first die tray to a single and unitary die boat. The second transfer module has an additional robotic arm disposed within the housing and configured to concurrently transfer all of the plurality of IC die from the single and unitary die boat to a single and unitary second die tray.