H01L21/67784

Micro LED transfer system

The present invention relates to provide a hot air supplying head for transferring a micro LED and a micro LED transfer system using the same, the hot air supplying head effectively transferring micro LEDs.

TRANSFER DEVICE, PROCESSING SYSTEM, AND TRANSFER METHOD
20230038276 · 2023-02-09 ·

According to one aspect of the present disclosure, a transfer device has a first holding part configured to contact an edge part of a substrate when holding the substrate, and a second holding part formed with an elastic member and configured to contact only a back surface of the substrate when holding the substrate.

GUIDED TRANSPORT PATH CORRECTION
20180014411 · 2018-01-11 ·

A printer deposits material onto a substrate as part of a manufacturing process for an electronic product; at least one transported component experiences error, which affects the deposition. This error is mitigated using transducers that equalize position of the component, e.g., to provide an “ideal” conveyance path, thereby permitting precise droplet placement notwithstanding the error. In one embodiment, an optical guide (e.g., using a laser) is used to define a desired path; sensors mounted to the component dynamically detect deviation from this path, with this deviation then being used to drive the transducers to immediately counteract the deviation. This error correction scheme can be applied to correct for more than type of transport error, for example, to correct for error in a substrate transport path, a printhead transport path and/or split-axis transport non-orthogonality.

PURGING SPINDLE ARMS TO PREVENT DEPOSITION AND WAFER SLIDING
20230005776 · 2023-01-05 ·

A system includes a plurality of spindle arms located above a plurality of stations in a processing chamber to transport a semiconductor substrate between the stations. The spindle arms reside in the processing chamber during processing of the semiconductor substrate. The system comprises first gas lines arranged below the stations to supply a purge gas. The system comprises second gas lines extending upwards from the first gas lines to supply the purge gas to the spindle arms during the processing of the semiconductor substrate in the processing chamber.

Apparatus and techniques for electronic device encapsulation

A method for providing a substrate coating comprises transferring a substrate to an enclosed ink jet printing system; printing organic material in a deposition region of the substrate using the enclosed ink jet printing system, the deposition region comprising at least a portion of an active region of a light-emitting device on the substrate; loading the substrate with the organic material deposited thereon to an enclosed curing module; supporting the substrate in the enclosed curing module, the supporting the substrate comprising floating the substrate on a gas cushion established by a floatation support apparatus; and while supporting the substrate in the enclosed curing module, curing the organic material deposited on the substrate to form an organic film layer.

Air conditioner, unit for floating conveying substrate with air conditioner, and method of supplying air for floating conveying substrate

An air conditioner includes a blower unit to blow air at a predetermined amount, a cooling unit arranged downstream of the blower unit in an air flowing direction, a compressor which is operated at a variable operating frequency so that a revolving speed thereof is adjustable, a condenser, and a cooling coil connected in this order by pipes to circulate a heating medium to cool blown air with a heating unit arranged on a downstream side of the cooling unit in the air flowing direction in which the blown air is heated by a heater, and a control unit controls the operating frequency of the compressor and includes a compressor control part which adjusts the revolving speed of the compressor such that the operating frequency of the compressor is decreased by a predetermined frequency when an output of the heating unit exceeds a first threshold value.

SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD USING THE SAME
20230114015 · 2023-04-13 ·

The present disclosure provides a substrate treating apparatus capable of stably moving a substrate and discharging an ink at an accurate position. The substrate treating apparatus of the present disclosure comprises: a stage extending in a first direction and moving a substrate along the first direction; moving units disposed on both sides of the stage extending in the first direction, respectively, and configured to move the substrate in the first direction; and a control unit configured to align the substrate, wherein the moving unit includes a first gripper and a second gripper configured to adsorb one side and the other side of the substrate, respectively, after the first gripper adsorbs one side of the substrate, the control unit aligns the substrate, and after the substrate is aligned, the second gripper adsorbs the other side of the substrate and the substrate is moved in the first direction.

Printing system assemblies and methods

The present teachings disclose various embodiments of a printing system for printing substrate, in which the printing system can be housed in a gas enclosure, where the environment within the enclosure can be maintained as a controlled printing environment. A controlled environment of the present teachings can include control of the type of gas environment within the gas enclosure, the size and level particulate matter within the enclosure, control of the temperature within the enclosure and control of lighting. Various embodiments of a printing system of the present teachings can include a Y-axis motion system and a Z-axis moving plate that are configured to substantially decrease excess thermal load within the enclosure by, for example, eliminating or substantially minimizing the use of conventional electric motors.

SUBSTRATE TRANSFER APPARATUS AND SUBSTRATE TRANSFER METHOD
20230143372 · 2023-05-11 ·

An apparatus for transferring a substrate to a substrate processing chamber is provided. The apparatus comprises: a substrate transfer chamber having a floor provided with a first magnet and a sidewall connected to the substrate processing chamber and having an opening through which a substrate is loaded into and unloaded from the substrate processing chamber; a substrate transfer module including a substrate holder configured to hold the substrate and a second magnet having a repulsive force against the first magnet, and configured to move in the substrate transfer chamber by magnetic levitation using the repulsive force; and a heating device configured to heat the substrate transfer module to release contaminants adhered to a surface of the substrate transfer module.

SUBSTRATE TRANSFER APPARATUS AND SUBSTRATE TRANSFER METHOD
20230154777 · 2023-05-18 ·

There is a substrate transfer apparatus comprising: a circular tube having a tube axis extending in a lateral direction and having a transfer region for a substrate in the circular tube; a magnetic field generating portion having a magnetic field generating surface facing the transfer region and configured to generate a magnetic field on the magnetic field generating surface; and a transfer body configured to transfer the substrate while moving in a plane direction of the magnetic field generating surface in a state that the transfer body is distant from the magnetic field generating surface by the magnetic field.