Manufacturing equipment with which steps from processing to sealing of an organic compound film can be continuously performed is provided. The manufacturing equipment enables continuous processing of a patterning step of a light-emitting device and a light-receiving device and a step of sealing top and side surfaces of organic layers to prevent the top and side surfaces from being exposed to the air, which allows formation of the light-emitting device and the light-receiving device each of which has a minute structure, high luminous, and high reliability. This manufacturing equipment can be built in an in-line manufacturing system where apparatuses are arranged according to the order of process steps for the light-emitting device and the light-receiving device, resulting in high throughput manufacturing.

A method for calibrating the alignment of a wafer is provided. A plurality of alignment position deviation (APD) simulation results are obtained form a plurality of mark profiles. An alignment analysis is performed on a mark region of the wafer with a light beam. A measured APD of the mark region of the wafer is obtained in response to the light beam. The measured APD is compared with the APD simulation results to obtain alignment calibration data. An exposure process is performed on the wafer with a mask according to the alignment calibration data.

A pre-jig wafer carrier disc installation/uninstallation device and a method thereof, including a first displacement mechanism, a wafer frame installation/uninstallation mechanism, a wafer installation/uninstallation mechanism, a mask installation/uninstallation mechanism and a robotic arm arranged around the first displacement mechanism. The said mechanisms sequentially stack the wafer frame, the wafer and the mask on the first displacement mechanism to form an assembly. An installation/uninstallation mechanism is disposed at a movable end of the robotic arm. The robotic arm drives the installation/uninstallation mechanism to remove and lock the assembly on an assembly carrier section of a carrier disc for successive processing. After the wafers are processed, the robotic arm drives the installation/uninstallation mechanism to move the assembly back onto the first displacement mechanism. The said mechanisms sequentially disassemble the assembly and recover the mask, the wafer and the wafer frame.

A method and an apparatus for bonding semiconductor substrates are provided. The apparatus includes a first support configured to carry a first semiconductor substrate and a second semiconductor substrate bonded to each other, a gauging component embedded in the first support and comprising a fiducial pattern, and a first sensor disposed proximate to the gauging component, and configured to emit a light source towards the fiducial pattern of the gauging component.

Provided is a substrate transferring method which is capable of accurately mounting a substrate at a desired rotation angle. In order to eliminate a misalignment of a wafer W in a rotational direction in a vacuum process chamber, which is caused by a variation in a transfer distance of the wafer W, the wafer W is mounted on a stage while being offset from the center of the stage in a load lock chamber and an angle of rotation of the wafer W with respect to a fork when a transfer arm receives the wafer W is changed.

An alignment module for positioning a mask on a substrate comprises a mask stocker, an alignment stage, and a transfer robot. The mask stocker houses a mask cassette that stores a plurality of masks. The alignment stage is configured to support a carrier and a substrate. The transfer robot is configured to transfer one of the one or more masks from the mask stocker to the alignment stage and position the mask over the substrate. The alignment module may be part of an integrated platform having one or more transfer chambers, a factory interface having a substrate carrier chamber and one or more processing chambers. A carrier may be coupled to a substrate within the substrate carrier chamber and moved between the processing chambers to generate a semiconductor device.

A method for monitoring performance of a manufacturing process is described. The method includes receiving one or more input signals that convey information related to geometry of a substrate generated by the manufacturing process; and determining, with a prediction model, variation in the manufacturing process based on the one or more input signals. A method for predicting substrate geometry associated with a manufacturing process is also described. The method includes receiving input information including geometry information and manufacturing process information for a substrate; and predicting, using a machine learning prediction model, output substrate geometry based on the input information. The method may further include tuning the predicted output substrate geometry. The tuning includes comparing the output substrate geometry to corresponding physical substrate measurements and/or predictions from a different non-machine learning prediction model, generating a loss function based on the comparison, and optimizing the loss function.

The present invention provides a large die, a method of forming the large die and a large die wafer. The method includes: providing a wafer containing a plurality of large dies each having a size greater than that of a maximum field of exposure of a stepper, each large die including at least two die portions to be stitched together, the die portions including a substrate and a first metal layer, the first metal layer including at least to-be-interconnected metal layers for interconnection of the die portions; and forming a second metal layer including at least inter-die interconnecting metal layers crossing dummy dicing margins between adjacent die portions and coming into electrical connection with the to-be-interconnected metal layers of the adjacent die portions. The present invention allows interconnection of the die portions to be stitched together in each large die.

Provided is a method of manufacturing a semiconductor device, including providing a substrate including a first region and a second region; forming an alignment mark in the substrate in the second region; forming a material layer on a first surface of the substrate in the first region and the second region; introducing heteroatoms into the substrate in the second region from a second surface of the substrate; and reacting the heteroatoms with the substrate to form a dielectric layer overlapping the alignment mark in the substrate in the second region.

A liquid crystal exposure apparatus that moves a substrate supported in a noncontact manner by a noncontact holder to a projection optical system, and performs scanning exposure to the substrate equipped with: holding pads that hold a part of the substrate located at a first position above the noncontact holder; adsorption pads that hold another part of the substrate; a first drive section moves the holding pads from below the substrate direction intersecting a vertical direction, where the substrate is located at the first position held by the adsorption pads; and a second drive section that moves the adsorption pads holding the substrate, to a second position where the substrate is supported in a noncontact manner by the noncontact holder, wherein the scanning exposure, the second drive section moves the adsorption pads holding the substrate supported in a noncontact manner by the noncontact holder to the projection optical system.