H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/02
Bonding areas; Manufacturing methods related thereto
H01L2224/02
Bonding areas; Manufacturing methods related thereto
H01L2224/039
Methods of manufacturing bonding areas involving a specific sequence of method steps
H01L2224/039
Methods of manufacturing bonding areas involving a specific sequence of method steps
H01L2224/0392
specifically adapted to include a probing step
H01L2224/0392
specifically adapted to include a probing step
H01L2224/03921
by repairing the bonding area damaged by the probing step
H01L2224/03921
by repairing the bonding area damaged by the probing step