Patent classifications
H
H01
H01L
2224/00
H01L2224/01
H01L2224/02
H01L2224/04
H01L2224/05
H01L2224/0554
H01L2224/05599
H01L2224/05698
H01L2224/05798
H01L2224/05799
H01L2224/05895
H01L2224/05895
Interconnect using embedded carbon nanofibers
Embodiments relate to the design of a device capable of increasing the electrical performance of an interconnect feature by amplifying the current carrying capacity of an interconnect feature. The device comprises a first body comprising a first surface with at least one nanoporous conductive structure protruding from the first surface. The device further comprises a second body comprising a second surface with arrays of nanofibers extending from the second surface and penetrating into corresponding nanoporous conductive structures to form conductive pathways between the first body and the second body.