Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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H01L2224/02
Bonding areas; Manufacturing methods related thereto
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H01L2224/04
Structure, shape, material or disposition of the bonding areas prior to the connecting process
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H01L2224/06
of a plurality of bonding areas
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H01L2224/0614
Circular array, i.e. array with radial symmetry
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H01L2224/06141
being uniform, i.e. having a uniform pitch across the array
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H01L2224/06141

DISPLAY DEVICE
20220392979 · 2022-12-08 · ·

A display device comprises a display panel including a display area including pixels, and a pad area adjacent to the display area, and a driving integrated circuit mounted on the pad area, wherein the pad area includes a stud pad area located at an edge of the pad area and including at least one stud pad electrode, the driving integrated circuit includes a circuit base, and at least one stud bump area overlapping the stud pad area in a thickness direction of the display device and including at least one stud bump, and the at least one stud pad electrode overlaps an edge portion of the at least one stud bump.

IC die, ultrasound probe, ultrasonic diagnostic system and method
10586753 · 2020-03-10 · ·

An integrated circuit (IC) die (100) is disclosed having a major surface delimited by at least one edge (102) of the IC die, said major surface carrying a plurality of electrically conductive contact plates (130) extending from said major surface beyond the at least one edge such that each contact plate includes an exposed contact surface portion (132) delimited by the at least one edge for mating with an electrically conductive further contact surface portion (230) on at least one further edge (220) of a body (200), said at least one further edge delimiting a cavity for receiving the IC die. An ultrasound probe including such an IC die and a method of providing such an IC die with contacts are also disclosed.

IC DIE, ULTRASOUND PROBE, ULTRASONIC DIAGNOSTIC SYSTEM AND METHOD
20170136496 · 2017-05-18 ·

An integrated circuit (IC) die (100) is disclosed having a major surface delimited by at least one edge (102) of the IC die, said major surface carrying a plurality of electrically conductive contact plates (130) extending from said major surface beyond the at least one edge such that each contact plate includes an exposed contact surface portion (132) delimited by the at least one edge for mating with an electrically conductive further contact surface portion (230) on at least one further edge (220) of a body (200), said at least one further edge delimiting a cavity for receiving the IC die. An ultrasound probe including such an IC die and a method of providing such an IC die with contacts are also disclosed.