Semiconductor devices are disclosed. According to some embodiments, a semiconductor device may include a memory array area and a peripheral area. The memory array area may include a number of memory cells and a number of array pads configured to receive an input voltage. The peripheral area may include a number of peripheral pads for interfacing with the memory array area. In these or other embodiments, the peripheral area may be arranged adjacent to a first edge of the semiconductor device and the number of array pads may be arranged proximate to a second edge of the semiconductor device. The second edge may be perpendicular to the first edge. The memory array area may also include an array distribution conductor configured to variously electrically connect the number of memory cells to the number of array pads. A semiconductor-device package and system are also disclosed.

A multi-chip package structure includes outer leads, a first chip and a second chip. The outer leads are disposed on four sides of a chip bonding area of a package carrier thereof, respectively. The first chip is fixed on the chip bonding area and includes a core and a seal ring. Input/output units, and first bonding pads are disposed, in an outward order, on the sides of the core. Each first bonding pad is electrically connected to a corresponding outer lead through a first wire. Dummy pads are disposed between the input/output units and the at least one side of the core. The second chip is stacked on the core and includes second bonding pads connected to the corresponding outer leads through second wires and dummy pads, so as to prevent from short circuit caused by soldering overlap and contact between the wires.

A multi-chip package structure includes outer leads, a first chip and a second chip. The outer leads are disposed on four sides of a chip bonding area of a package carrier thereof, respectively. The first chip is fixed on the chip bonding area and includes a core and a seal ring. Input/output units, and first bonding pads are disposed, in an outward order, on the sides of the core. Each first bonding pad is electrically connected to a corresponding outer lead through a first wire. Dummy pads are disposed between the input/output units and the at least one side of the core. The second chip is stacked on the core and includes second bonding pads connected to the corresponding outer leads through second wires and dummy pads, so as to prevent from short circuit caused by soldering overlap and contact between the wires.

A semiconductor device structure and method of manufacturing a semiconductor device. The semiconductor device may comprise a semiconductor die having a top major surface that has one or more electrical contacts formed thereon, an opposing bottom major surface, and side surfaces; a molding material encapsulating the top major surface, the bottom major surface and the side surfaces of the semiconductor die, wherein the molding material defines a package body that has a top surface and a side surface; wherein the plurality of electrical contacts are exposed on the top surface of the package body and a metal layer is arranged over and electrically connected to the electrical contacts and wherein the metal layer extends to and at least partially covers a side surface of the package body.

Semiconductor devices are disclosed. According to some embodiments, a semiconductor device may include a memory array area and a peripheral area. The memory array area may include a number of memory cells and a number of array pads configured to receive an input voltage. The peripheral area may include a number of peripheral pads for interfacing with the memory array area. In these or other embodiments, the peripheral area may be arranged adjacent to a first edge of the semiconductor device and the number of array pads may be arranged proximate to a second edge of the semiconductor device. The second edge may be perpendicular to the first edge. The memory array area may also include an array distribution conductor configured to variously electrically connect the number of memory cells to the number of array pads. A semiconductor-device package and system are also disclosed.

A semiconductor device structure and method of manufacturing a semiconductor device. The semiconductor device may comprise a semiconductor die having a top major surface that has one or more electrical contacts formed thereon, an opposing bottom major surface, and side surfaces; a molding material encapsulating the top major surface, the bottom major surface and the side surfaces of the semiconductor die, wherein the molding material defines a package body that has a top surface and a side surface; wherein the plurality of electrical contacts are exposed on the top surface of the package body and a metal layer is arranged over and electrically connected to the electrical contacts and wherein the metal layer extends to and at least partially covers a side surface of the package body.