A display device includes a display panel including panel pads adjacent to the side surface of a display panel; connection pads disposed on the side surface of the display panel and connected to the panel pads; and a circuit board disposed on the side surface of the display panel and including lead signal lines directly bonded to the connection pads, wherein the connection pads include a first connection pad, a second connection pad disposed on the first connection pad, and a third connection pad disposed on the second connection pad, and the first connection pad is in contact with corresponding one of the panel pads, and the third connection pad is directly bonded to corresponding one of the lead signal lines.

A semiconductor storage device includes a first chip bonded to a second chip. The first chip includes electrode layers stacked in a first direction, a pillar extending through the stacked electrode layers and including a semiconductor film, and a memory film between the semiconductor film and the electrode layers. The second chip includes a semiconductor substrate having transistors formed thereon, a wiring connected to the transistors and between the semiconductor substrate and the first chip, bonding pads at a level closer to the first chip than the transistors. The bonding pads have a bonding surface facing away from the first chip. An opening extends through the semiconductor substrate to the bonding surface of the bonding pad.

A display device includes a display panel including panel pads adjacent to the side surface of a display panel; connection pads disposed on the side surface of the display panel and connected to the panel pads; and a circuit board disposed on the side surface of the display panel and including lead signal lines directly bonded to the connection pads, wherein the connection pads include a first connection pad, a second connection pad disposed on the first connection pad, and a third connection pad disposed on the second connection pad, and the first connection pad is in contact with corresponding one of the panel pads, and the third connection pad is directly bonded to corresponding one of the lead signal lines.

A semiconductor storage device includes a first chip bonded to a second chip. The first chip includes electrode layers stacked in a first direction, a pillar extending through the stacked electrode layers and including a semiconductor film, and a memory film between the semiconductor film and the electrode layers. The second chip includes a semiconductor substrate having transistors formed thereon, a wiring connected to the transistors and between the semiconductor substrate and the first chip, bonding pads at a level closer to the first chip than the transistors. The bonding pads have a bonding surface facing away from the first chip. An opening extends through the semiconductor substrate to the bonding surface of the bonding pad.