An attachment structure for an electronic component accommodation box including a vibration proof structure includes a damping structure between a vehicle body side attachment member and a casing in which at least one electronic component is mounted. The damping structure includes first sliding portions, second sliding portions, and damping members interposed between the first sliding portions and the second sliding portions. The damping members generate sliding resistance between each of the first sliding portions and each of the second sliding portions when the casing moves relative to the vehicle body side attachment member.

[Problem] To provide an electrode connection structure and the like in which a plurality of elongated leads are arranged in parallel and a longitudinal side surface of each lead is connected to an electrode by plating treatment with high quality. [Solution] An electrode connection structure in which a semiconductor chip 12 electrode and/or a substrate electrode is connected to a plurality of elongated leads 11 of a lead frame 10 by plating. The plurality of elongated leads 11 of the lead frame 10 are arranged in parallel, and a longitudinal side surface of each lead 11 is connected to the semiconductor chip 12 electrode and/or the substrate electrode by plating. At a connection portion of a first connection surface 13 of the semiconductor chip 12 electrode and/or the substrate electrode, the first connection surface 13 being connected to the leads 11, and a second connection surface 14 in the longitudinal side surface of each lead 11, the second connection surface 14 being connected to the first connection surface 13, a distance between the first connection surface 13 and the second connection surface 14 continuously increases from an edge portion 15 of the second connection surface 14, the edge portion 15 being in contact with the first connection surface 13, toward an outer portion 16 of the second connection surface 14.

[Problem] To provide an electrode connection structure and the like in which a plurality of elongated leads are arranged in parallel and a longitudinal side surface of each lead is connected to an electrode by plating treatment with high quality.

[Solution] An electrode connection structure in which a semiconductor chip 12 electrode and/or a substrate electrode is connected to a plurality of elongated leads 11 of a lead frame 10 by plating. The plurality of elongated leads 11 of the lead frame 10 are arranged in parallel, and a longitudinal side surface of each lead 11 is connected to the semiconductor chip 12 electrode and/or the substrate electrode by plating. At a connection portion of a first connection surface 13 of the semiconductor chip 12 electrode and/or the substrate electrode, the first connection surface 13 being connected to the leads 11, and a second connection surface 14 in the longitudinal side surface of each lead 11, the second connection surface 14 being connected to the first connection surface 13, a distance between the first connection surface 13 and the second connection surface 14 continuously increases from an edge portion 15 of the second connection surface 14, the edge portion 15 being in contact with the first connection surface 13, toward an outer portion 16 of the second connection surface 14.

An attachment structure for an electronic component accommodation box including a vibration proof structure includes a damping structure between a vehicle body side attachment member and a casing in which at least one electronic component is mounted. The damping structure includes first sliding portions, second sliding portions, and damping members interposed between the first sliding portions and the second sliding portions. The damping members generate sliding resistance between each of the first sliding portions and each of the second sliding portions when the casing moves relative to the vehicle body side attachment member.

Aspects of the present disclosure include integrated circuit (IC) structures with angled interconnect elements. An IC structure according to the present disclosure can include: an IC chip interconnect surface including a radially inner region positioned within a radially outer region; and a plurality of conductive pillars extending outward from the radially inner region of the IC chip interconnect surface, relative to a radial centerline axis of the radially inner region of the IC chip interconnect surface, wherein the radially inner region of the IC chip interconnect surface is free of conductive pillars thereon.

Aspects of the present disclosure include integrated circuit (IC) structures with angled interconnect elements. An IC structure according to the present disclosure can include: an IC chip interconnect surface including a radially inner region positioned within a radially outer region; and a plurality of conductive pillars extending outward from the radially inner region of the IC chip interconnect surface, relative to a radial centerline axis of the radially inner region of the IC chip interconnect surface, wherein the radially inner region of the IC chip interconnect surface is free of conductive pillars thereon.