An electronic package includes a patterned conductive layer and at least one conductive protrusion on the patterned conductive layer. The at least one conductive protrusion has a first top surface. The patterned conductive layer and the at least one conductive protrusion define a space. The electronic package further includes a first electronic component disposed in the space and a plurality of conductive pillars on the first electronic component. The conductive pillars have a second top surface. The first top surface is substantially level with the second top surface.

A memory device including a base chip and a memory cube mounted on and connected with the base chip is described. The memory cube includes multiple stacked tiers, and each tier of the multiple stacked tiers includes semiconductor chips laterally wrapped by an encapsulant and a redistribution structure. The semiconductor chips of the multiple stacked tiers are electrically connected with the base chip through the redistribution structures in the multiple stacked tiers. The memory cube includes a thermal path structure extending through the multiple stacked tiers and connected to the base chip. The thermal path structure has a thermal conductivity larger than that of the encapsulant. The thermal path structure is electrically isolated from the semiconductor chips in the multiple stacked tiers and the base chip.

A display device invention includes a substrate on which a plurality of light emitting elements are disposed. A plurality of lines are disposed on an upper surface of the substrate. A plurality of upper pads are disposed on the upper surface of the substrate and electrically connected to the plurality of lines. A plurality of link lines are disposed on a lower surface of the substrate. A plurality of lower pads are disposed on the lower surface of the substrate and electrically connected to the plurality of link lines. A plurality of side lines electrically connect the plurality of upper pads and the plurality of lower pads. The plurality of side lines include a plurality of first side lines and a plurality of second side lines, and the plurality of first side lines and the plurality of second side lines are disposed on different layers.

A light-emitting element including: a first semiconductor layer doped with a first type of dopant; a second semiconductor layer doped with a second type of dopant that is different from the first type of dopant; and an active layer between the first semiconductor layer and the second semiconductor layer, wherein a length of the light-emitting element measured in a first direction, which may be a direction in which the first semiconductor layer, the active layer, and the second semiconductor layer may be arranged, may be shorter than the width measured in a second direction that is perpendicular to the first direction.

Disclosed are a system-on-chip integrated packaging structure, a manufacturing method therefor and a three-dimensional stacked device. The system-on-chip integrated packaging structure includes: a substrate, a chip, a first electrical connection structure and a second electrical connection structure. A front surface of the substrate is provided with a recess and a via welding pad, and a back surface of the substrate is provided with a conductive via extending to the via welding pad. The chip is embedded in the recess, and a chip welding pad is disposed on a surface of the chip away from a bottom surface of the recess. Different chips may be electrically connected by means of the first electrical connection structure and the second electrical connection structure, which is conducive to form a three-dimensional stacked structure with high-density interconnection, miniaturized packaging and thinning.

A display device is provided. The display device comprising: a substrate including a display area and a pad area, a first conductive layer disposed on the substrate and including a first signal line disposed in the display area, a buffer layer disposed on the first conductive layer, a semiconductor layer disposed on the buffer layer in the display area, a gate insulating film disposed on the semiconductor layer, a second conductive layer disposed on the gate insulating film and including a gate electrode overlapping the semiconductor layer in the display area, a first electrode of a transistor disposed to overlap one side of the semiconductor layer in the display area and connected to the first signal line through a contact hole penetrating through the buffer layer and the gate insulating film, and a second electrode of the transistor disposed to overlap the other side of the semiconductor layer in the display area, a first pad disposed on the buffer layer in the pad area and exposed by a pad opening, a first insulating layer disposed on the second conductive layer and the first pad, and a light emitting element disposed on the first insulating layer in the display area, wherein the first pad is formed of the first conductive layer or the second conductive layer.

A display device includes a substrate, a light emitting element on the substrate, and including a first end portion and a second end portion that are aligned in a first direction that is substantially parallel to an upper surface of the substrate, a first contact electrode in contact with the first end portion of the light emitting element, a first electrode on the first contact electrode, and electrically connected to the first end portion of the light emitting element through the first contact electrode, and a second electrode electrically connected to the second end portion of the light emitting element.

A pixel may include first and second electrodes spaced apart from each other along a first direction, first light emitting elements arranged along a second direction in a first area between the first electrode and the second electrode, and including a first end portion adjacent to the first electrode and a second end portion adjacent to the second electrode, a first contact electrode on the first end portions of the first light emitting elements, and including a transparent electrode layer, a second contact electrode on the second end portions of the first light emitting elements, and including a reflective electrode layer, a first bank pattern overlapping a portion of the first electrode beneath the first electrode, and a second bank pattern overlapping a portion of the second electrode beneath the second electrode, wherein the first and second bank patterns are spaced apart from the first area by different distances.

A semiconductor package includes a lower semiconductor device, a plurality of conductive pillars, an upper semiconductor device, an encapsulating material, and a redistribution structure. The plurality of conductive pillars are disposed on the lower semiconductor device along a direction parallel to a side of the lower semiconductor device. The upper semiconductor device is disposed on the lower semiconductor device and reveals a portion of the lower semiconductor device where the plurality of conductive pillars are disposed, wherein the plurality of conductive pillars disposed by the same side of the upper semiconductor device and the upper semiconductor device comprises a cantilever part cantilevered over the at least one lower semiconductor device. The encapsulating material encapsulates the lower semiconductor device, the plurality of conductive pillars, and the upper semiconductor device. The redistribution structure is disposed over the upper semiconductor device and the encapsulating material.

A display device includes a substrate including a display area including pixel areas and a non-display area adjacent to the display area; and a pixel disposed in each of the pixel areas. The pixel includes a sub-electrode, a first conductive line, and a second conductive line on the substrate; a first insulating layer over the sub-electrode and the first and second conductive lines; first to fourth electrodes on the first insulating layer; a second insulating layer over the first and second electrodes to completely overlap the first and second electrodes, the second insulating layer exposing the third and fourth electrodes; light emitting elements between the first and second electrodes; a first contact electrode on the first electrode; and a second contact electrode on the second electrode.