A method of manufacturing a substrate layered body includes: a step of applying a bonding material to the surface of at least one of a first substrate or a second substrate; a step of curing the bonding material applied on the surface to form a bonding layer having a reduced modulus at 23° C. of 10 GPa or less; and a step of bonding the first substrate and the second substrate via the bonding layer formed.

Embodiments of the present disclosure include devices and methods of forming the same. An embodiment is a device including a solder resist coating over a first side of a substrate, an active surface of a die bonded to the first side of the substrate by a first connector, and a surface mount device mounted to the die by a second set of connectors, the surface mount device being between the die and the first side of the substrate, the surface mount device being spaced from the solder resist coating.

A method of manufacturing a substrate layered body includes: a step of applying a bonding material to the surface of at least one of a first substrate or a second substrate; a step of curing the bonding material applied on the surface to form a bonding layer having a reduced modulus at 23 C. of 10 GPa or less; and a step of bonding the first substrate and the second substrate via the bonding layer formed.

A semiconductor device including: a die paddle having an upper surface; a solder layer disposed on the upper surface of the die paddle; and a die disposed on the solder layer, so that the solder layer is between the die paddle and the die; the solder layer includes a plurality of spacers configured to be, during production of the semiconductor device prior to hardening of the solder layer, movable in relation to the die paddle; and the die paddle includes a plurality of recesses in the upper surface of the die paddle, and the plurality of recesses is configured to receive the plurality of spacers, so that the plurality of spacers is embedded within the plurality of recesses.