Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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H01L2224/26
Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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H01L2224/278
Post-treatment of the layer connector
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H01L2224/2782
Applying permanent coating, e.g. in-situ coating
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H01L2224/27823
Immersion coating, e.g. in a solder bath
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H01L2224/27823

Immersion plating treatments for indium passivation
11535945 · 2022-12-27 · ·

A bonding structure formed on a substrate includes an indium layer and a passivating nickel plating formed on the indium layer. The nickel plating serves to prevent a reaction involving the indium layer.

Immersion plating treatments for indium passivation
11535945 · 2022-12-27 · ·

A bonding structure formed on a substrate includes an indium layer and a passivating nickel plating formed on the indium layer. The nickel plating serves to prevent a reaction involving the indium layer.

IMMERSION PLATING TREATMENTS FOR INDIUM PASSIVATION
20210198798 · 2021-07-01 ·

A bonding structure formed on a substrate includes an indium layer and a passivating nickel plating formed on the indium layer. The nickel plating serves to prevent a reaction involving the indium layer.

IMMERSION PLATING TREATMENTS FOR INDIUM PASSIVATION
20210198798 · 2021-07-01 ·

A bonding structure formed on a substrate includes an indium layer and a passivating nickel plating formed on the indium layer. The nickel plating serves to prevent a reaction involving the indium layer.