Package structure and method of manufacturing the same are provided. The package structure includes a first die, a second die, a first encapsulant, a bridge die, and a second encapsulant. The first encapsulant laterally encapsulates the first die and the second die. The bridge die is electrically connected to the first die and the second die. The second encapsulant is located over the first die, the second die and the first encapsulant, laterally encapsulating the bridge die and filling a space between the bridge die and the first die, between the bridge die and the first encapsulant and between the bridge die and the second die. A material of the second encapsulant is different from a material of the first encapsulant.

Package structure and method of manufacturing the same are provided. The package structure includes a first die, a second die, a first encapsulant, a third die, and a second encapsulant. The first die and the second die laterally aside the first die. The first encapsulant laterally encapsulates the first die and the second die. The third die is electrically connected to the first die and the second die. The second encapsulant is over the first die, the second die and the first encapsulant, laterally encapsulating the third die. The first encapsulant includes a plurality of first fillers, the second encapsulant includes a plurality of second fillers, and a content of the second fillers in the second encapsulant is less than a content of the first fillers in the first encapsulant.

A chip package may include: a first die; at least one second die disposed over the first die; and a lid disposed over lateral portions of the first die and at least partially surrounding the at least one second die, the lid having inclined sidewalls spaced apart from and facing the at least one second die.

Package structure and method of manufacturing the same are provided. The package structure includes a first die, a second die, a first encapsulant, a bridge die, and a second encapsulant. The first encapsulant laterally encapsulates the first die and the second die. The bridge die is electrically connected to the first die and the second die. The second encapsulant is located over the first die, the second die and the first encapsulant, laterally encapsulating the bridge die and filling a space between the bridge die and the first die, between the bridge die and the first encapsulant and between the bridge die and the second die. A material of the second encapsulant is different from a material of the first encapsulant.

Package structure and method of manufacturing the same are provided. The package structure includes a first die, a second die, a first encapsulant, a third die, and a second encapsulant. The first die and the second die laterally aside the first die. The first encapsulant laterally encapsulates the first die and the second die. The third die is electrically connected to the first die and the second die. The second encapsulant is over the first die, the second die and the first encapsulant, laterally encapsulating the third die. The first encapsulant includes a plurality of first fillers, the second encapsulant includes a plurality of second fillers, and a content of the second fillers in the second encapsulant is less than a content of the first fillers in the first encapsulant.

Anisotropic conductive connections for interconnect bridges and related methods are disclosed herein. An example a package substrate for an integrated circuit package, the package substrate comprising a first pad disposed at a first end of an interconnect within the package substrate, the first pad disposed in a cavity in the package substrate, an interconnect bridge disposed in the cavity, the interconnect bridge including a second pad, and a third pad, and a layer disposed between the first pad and the second pad, the layer having a first conductivity between the first pad and the second pad, the layer having a second conductivity between the second pad and the third pad, the first conductivity greater than the second conductivity.