Patent classifications
H
ELECTRICITY
Load children
H01
ELECTRIC ELEMENTS
Load children
H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
Load children
2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/34
Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/36
Structure, shape, material or disposition of the strap connectors prior to the connecting process
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/37
of an individual strap connector
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/37001
Core members of the connector
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/37198
with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/37499
Shape or distribution of the fillers
Filter patents View analytics View as hierarchy Open in page

H01L2224/37499

CLIP
20250105198 · 2025-03-27 · ·

There is disclosed a clip for a semi-conductor device. At least part of the clip is formed from a metallic foam.