Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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H01L2224/34
Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
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H01L2224/36
Structure, shape, material or disposition of the strap connectors prior to the connecting process
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H01L2224/37
of an individual strap connector
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H01L2224/376
with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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H01L2224/37601
the principal constituent melting at a temperature of less than 400°C
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H01L2224/37616
Lead [Pb] as principal constituent
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H01L2224/37616

Connection member with bulk body and electrically and thermally conductive coating
20190131218 · 2019-05-02 ·

A connection member for connecting an electronic chip, wherein the connection member comprises a bulk body, and a coating at least partially coating the bulk body and comprising a material having higher electric and higher thermal conductivity than the bulk body, wherein a ratio between a thickness of the coating and a thickness of the bulk body is at least 0.0016 at at least a part of the connection member.