Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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H01L2224/34
Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
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H01L2224/39
Structure, shape, material or disposition of the strap connectors after the connecting process
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H01L2224/40
of an individual strap connector
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H01L2224/40151
Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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H01L2224/40221
the body and the item being stacked
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H01L2224/40225
the item being non-metallic, e.g. insulating substrate with or without metallisation
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H01L2224/40235
Connecting the strap to a via metallisation of the item
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H01L2224/40235

INTEGRATED CIRCUIT PACKAGE WITH BACKSIDE LEAD FOR CLOCK TREE OR POWER DISTRIBUTION NETWORK CIRCUITS
20230290765 · 2023-09-14 · ·

An apparatus having a substrate having first and second substrate contacts; a chip having a front-side chip contact and first and second back-side chip contacts, the front-side chip contact electrically connected to the first substrate contact; a chiplet having a chiplet contact electrically connected the first back-side chip contact; and a lead electrically connected to the second back-side chip contact and electrically connected to the second substrate contact.

Integrated power package
09768130 · 2017-09-19 · ·

An integrated power package includes a substrate having a first surface and an integrated circuit located within the substrate. At least one electrical conductor is located between the first surface and another point on the substrate. At least one transistor is electrically and mechanically coupled to the at least one first conductor. A support structure is electrically and mechanically coupled to the at least one transistor, wherein the at least one transistor is located between the first surface of the substrate and the support structure.

INTEGRATED POWER PACKAGE
20170117238 · 2017-04-27 ·

An integrated power package includes a substrate having a first surface and an integrated circuit located within the substrate. At least one electrical conductor is located between the first surface and another point on the substrate. At least one transistor is electrically and mechanically coupled to the at least one first conductor. A support structure is electrically and mechanically coupled to the at least one transistor, wherein the at least one transistor is located between the first surface of the substrate and the support structure.