A lead frame for a hermetic RF chip package includes: a first capacitor unit formed of a conductive material in a rectangular shape having a width smaller than a length to receive an input of an RF signal applied to the package circuit; a first inductor unit connected to the first capacitor unit and formed of a conductive material in a rectangular shape having a width greater than a length; a second capacitor unit connected to the first inductor unit and formed of a conductive material in a rectangular shape having a width smaller than a length; and a second inductor unit connected to the second capacitor unit and formed of a conductive material in a rectangular shape having a width greater than a length to transfer an RF signal input through the first capacitor unit to the RF chip.

A lead frame for a hermetic RF chip package includes: a first capacitor unit formed of a conductive material in a rectangular shape having a width smaller than a length to receive an input of an RF signal applied to the package circuit; a first inductor unit connected to the first capacitor unit and formed of a conductive material in a rectangular shape having a width greater than a length; a second capacitor unit connected to the first inductor unit and formed of a conductive material in a rectangular shape having a width smaller than a length; and a second inductor unit connected to the second capacitor unit and formed of a conductive material in a rectangular shape having a width greater than a length to transfer an RF signal input through the first capacitor unit to the RF chip.

An electronic module comprises a substrate 11, 21, an other-side electronic component 18, 23 provided on the other side of the substrate 11, 21, a one-side electronic component 13, 28 provided on one side of the substrate 11, 21 and a connecting terminal 115, 125 having an other-side extending part 119a, 129a extending to circumferential outside of the substrate 11, 21 on the other side of the substrate 11, 21, a one-side extending part 119b, 129b extending to circumferential outside of the substrate 11, 21 on one side of the substrate 11, 21, and a connecting part 118, 128 connecting the other-side extending part 119a, 129a with the one-side extending part 119b, 129b at the circumferential outside of the substrate 11, 21.

According to one embodiment, a semiconductor device includes: a semiconductor chip including a first surface, a second surface, a first electrode, a second electrode, and a third electrode; a first conductor including a first portion and a first intermediate portion, a second conductor including a third portion, a second intermediate portion, and a fourth portion, and a length of the first intermediate portion in a second direction being longer than a length of the third portion in the second direction; a third conductor provided on a first surface side of the semiconductor chip; a conductive first connector provided between the first intermediate portion of the first conductor and the third portion of the second conductor; a conductive second connector provided between the second electrode and the first portion; and a conductive third connector provided between the third conductor and the first electrode.

An electronic module comprises a substrate 11, 21, an other-side electronic component 18, 23 provided on the other side of the substrate 11, 21, a one-side electronic component 13, 28 provided on one side of the substrate 11, 21 and a connecting terminal 115, 125 having an other-side extending part 119a, 129a extending to circumferential outside of the substrate 11, 21 on the other side of the substrate 11, 21, a one-side extending part 119b, 129b extending to circumferential outside of the substrate 11, 21 on one side of the substrate 11, 21, and a connecting part 118, 128 connecting the other-side extending part 119a, 129a with the one-side extending part 119b, 129b at the circumferential outside of the substrate 11, 21.