H01L2224/45026

Bonding Wire and Method for Manufacturing the Same
20230125151 · 2023-04-27 ·

A bonding wire includes a hollow member made of an insulator and mounted such as to bridge ICs formed with interconnects, such that a plurality of open ends is each closed by abutting on a surface of the interconnect that is a connection target, and a connection member made of a conductor, filling inside of the hollow member such as to bond to the surface of the interconnect at a location where the hollow member abuts on the surface of the interconnect.

TEMPERATURE-STABLE COMPOSITE OF A STRANDED WIRE HAVING A CONTACT PAD
20230318207 · 2023-10-05 ·

The invention relates to an electrical element having at least one functional region and a contact surface, wherein a connecting element is arranged on the contact surface, wherein the connecting element comprises a stranded wire coated with sintered material, wherein the stranded wire is connected, in particular sintered, to the contact surface by a sintered material. Furthermore, the invention relates to a method for producing the electrical element according to the invention.

Temperature-stable composite of a stranded wire having a contact pad
12308588 · 2025-05-20 · ·

The invention relates to an electrical element having at least one functional region and a contact surface, wherein a connecting element is arranged on the contact surface, wherein the connecting element comprises a stranded wire coated with sintered material, wherein the stranded wire is connected, in particular sintered, to the contact surface by a sintered material. Furthermore, the invention relates to a method for producing the electrical element according to the invention.

ELECTRONIC MODULES HAVING ELECTRICAL CONNECTION ELEMENTS IN THE FORM OF WEDGE-WEDGE-BONDED STRUCTURES NOT CONSISTING OF SOLID METAL MATERIAL

An electronic module comprising one or more assemblies each consisting of a first electronic component with a first contact surface with a first end, wedge-bonded on this first contact surface, and a second electronic component with a second contact surface with a second end, wedge-bonded on this second contact surface, wherein the originally free structure not made of solid metal material is a structure (i) in the form of a ribbon made from warp-knitted, weft-knitted, woven or braided fine metal wire and having a cross-sectional area within a range of 25,000 to 800,000 m.sup.2, or (ii) in the form of a cable made from stranded fine metal wire and having a cross-sectional area within a range of 8,000 to 600,000 m.sup.2, or (iii) in the form of a tube made from circular-warp-knitted or circular-weft-knitted fine metal wire and having a cross-sectional area within a range of 8,000 to 600,000 m.sup.2.