A wire includes an elongate conductive core wire, an elongate insulating layer disposed on and surrounding the elongate conductive core wire, an elongate conductive shield wire disposed adjacent to the insulating layer and the elongate conductive core wire, an elongate conductive shield layer disposed on the insulating layer and on the conductive shield wire such that the elongate insulating layer, the elongate conductive core wire, and the elongate conductive shield wire are embedded in the elongate conductive shield layer, the elongate conductive shield wire being electrically connected to the elongate conductive shield layer.

Techniques for thermal management of an integrated circuit die are provided. In an example, an apparatus can include a first integrated circuit die having a thermal bond pad and a plurality of active components and a pair of thermoelectric bond wires. The thermal bond pad can be electrically isolated from the plurality of active components and the pair of thermoelectric bond wires can be coupled to the thermal bond pad at a bond location.

An electronic device may comprise a semiconductor element and a wire bond connecting the semiconductor element to a substrate. Using a woven bonding wire may improve the mechanical and electrical properties of the wire bond. Furthermore, there may be a cost benefit. Woven bonding wires may be used in any electronic device, for example in power devices or integrated logic devices.